CURRENT 0.8 Amperes
VOLTAGE 100 to 1000 Volts
S40S THRU S500S
Features
· Glass Passivated Die Construction
· Diffused Junction
L
G
· Low Forward Voltage Drop, High Current Capability
· Surge Overload Rating to 30A Peak
· Designed for Printed Circuit Board Applications
· Plastic Material - UL Flammability Classification 94V-0
A
B
D E
H
C
J
MiniDIP
Min
Dim
A
Max
5.75
4.00
0.35
0.20
7.00
1.10
4.90
2.90
2.70
0.80
K
5.43
Mechanical Data
B
3.60
C
0.15
· Case : Molded Plastic
D
E
0.05
· Terminals : Solder Plated Leads,
Solderable per MIL-STD-202, Method 2026
· Polarity : As Marked on Case
· Approx. Weight : 0.125 grams
· Mounting Position : Any
G
H
J
0.70
4.50
2.80
2.50
0.50
K
· Marking : Type Number
L
All Dimens ions in mm
Maximum Ratings And Electrical Characteristics
(Ratings at 25℃ ambient temperature unless otherwise specified, Single phase, half wave 60Hz, resistive or inductive
load. For capacitive load, derate by 20%)
Symbols
Units
S40S
S80S
S125S S250S S380S S500S
Peak Repetitive Reverse voltage
Working Peak Reverse voltage
DC Blocking voltage
V
V
V
RMM
RWM
100
70
200
140
400
280
600
420
800
560
1000
700
Volts
R
RMS Reverse voltage
V
RMS
Volts
Amp
Average Rectified Output Current @ T
A
=40
Io
0.8
30
℃
Non-Repetitive Peak Forward Surge Current,
8.3ms single half-sine-wave superimposed
on rated load (JEDEC method)
I
FSM
Amp
VFM
1.0
Volts
Forward voltage (per element)
@ IF=0.4 A
@ T
A
=25℃
10
Peak Reverse Current at Rated
DC Blocking voltage (per element)
I
RM
μA
@ TA
=125℃
500
Typical Junction Capacitance
per element (Note 1)
C
j
10
75
pF
Typical Thermal Resistance,
Junction to Ambient (Note 2)
℃/W
RθJA
T
STG
j
Operating and Storage Temperature Range
-55 to +150
℃
T
Notes:
(1) Measured at 1.0MHz and Applied Reverse Voltage of 4.0V DC.
(2) Thermal Resistance, junction to ambient, measured on PC board with 5.02mm (0.03mm thick) land areas.