S3A - S3M
3.0A SURFACE MOUNT GLASS PASSIVATED RECTIFIER
Features
ꢀ
ꢀ
Glass Passivated Die Construction
Low Forward Voltage Drop and High Current
Capability
SMB
Min
SMC
Min
B
ꢀ
ꢀ
Surge Overload Rating to 100A Peak
Ideally Suited for Automatic Assembly
Dim
A
Max
3.94
4.57
2.21
0.31
5.59
0.20
1.52
2.62
Max
6.22
7.11
3.18
0.31
8.13
0.20
1.52
2.62
3.30
4.06
1.96
0.15
5.00
0.10
0.76
2.00
5.59
6.60
2.75
0.15
7.75
0.10
0.76
2.00
A
J
C
D
B
Mechanical Data
ꢀ
C
Case: Molded Plastic
Case Material - UL Flammability Rating
Classification 94V-0
Moisture sensitivity: Level 1 per J-STD-020A
Terminals: Solder Plated Terminal - Solderable
per MIL-STD-202, Method 208
D
ꢀ
E
ꢀ
ꢀ
G
H
G
J
H
ꢀ
ꢀ
Polarity: Cathode Band or Cathode Notch
E
All Dimensions in mm
Weight: SMB 0.093 grams (approx)
SMC 0.21 grams (approx)
AB, BB, DB, GB, JB, KB, MB Suffix Designates SMB Package
A, B, D, G, J, K, M Designates SMC Package
ꢀ
ꢀ
Marking: Type Number & Date Code,
See Page 2
Ordering Information: See Page 2
@ TA = 25°C unless otherwise specified
Maximum Ratings and Electrical Characteristics
Single phase, half wave, 60Hz, resistive or inductive load.
For capacitive load, derate current by 20%.
S3
A/AB
S3
B/BB
S3
D/DB
S3
G/GB
S3
J/JB
S3
K/KB
S3
M/MB
Characteristic
Symbo
Unit
VRRM
VRWM
VR
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
50
100
70
200
140
400
600
420
800
560
1000
700
V
VR(RMS)
RMS Reverse Voltage
30
280
3.0
V
A
Average Rectified Output Current
@TT = 75°C
IO
Non-Repetitive Peak Forward Surge Current 8.3ms
single half sine-wave superimposed on rated load
(JEDEC Method)
IFSM
100
A
Forward Voltage
@ IF = 3.0A
VFM
IRM
1.15
V
µA
Peak Reverse Current
at Rated DC Blocking Voltage
@TA 25°C
=
10
250
@ TA = 125 °C
CT
Typical Total Capacitance (Note 1)
40
10
pF
Typical Thermal Resistance Junction to Terminal
(Note 2)
RꢁJT
Tj, TSTG
°C/W
°C
Operating and Storage Temperature Range
-65 to +150
Notes:
1. Measured at 1.0 MHz and applied reverse voltage of 4.0V DC.
2. Thermal resistance: Junction to Terminal, unit mounted on PC board with 5.0 mm2 (0.013 mm thick) copper pad as heat sink.