S3JBFL THRU S3MBFL
Features
• Halogen Free. “Green” Device (Note 1)
• Epoxy Meets UL 94 V-0 Flammability Rating
• Moisture Sensitivity Level 1
• Glass Passivated Chip Junction
• Low Profile Package
• For Surface Mount Applications
• High Forward Surge Capability
• Lead Free Finish/RoHS Compliant (Note 2) ("P"Suffix Designates
3 Amp Glass
Passivated Rectifier
600 to 1000 Volts
Compliant. See Ordering Information)
Maximum Ratings
• Operating Junction Temperature Range: -55⁰C to +150⁰C
• Storage Temperature Range: -55⁰C to +150⁰C
SMBF
• Typical Thermal Resistance(Note 3): 15°C/W Junction to Case
• Typical Thermal Resistance(Note 3): 20°C/W Junction to Lead
• Typical Thermal Resistance(Note 3): 60°C/W Junction to Ambient
C
Maximum
Cathode Mark
B
A
Maximum DC
Maximum
RMS
Voltage
MCC
Device
Recurrent
Peak Reverse
Voltage
Blocking
Voltage
Part Number
Marking
F
S3JBFL
S3MBFL
S3JB
600V
420V
700V
600V
1000V
S3MB
1000V
Electrical Characteristics @ 25°C Unless Otherwise Specified
Average Forward
Current
IO
3.0A
TL=85⁰C
E
G
D
100A
8.3ms,Half-Sine Wave
1ms,Square Wave
Non-Repetitive Peak
Forward Surge Current
IFSM
200A
DIMENSIONS
MM
MIN MAX MIN MAX
0.134 0.150 3.40 3.80
0.075 0.083 1.90 2.10
0.163 0.175 4.15 4.45
0.201 0.220 5.10 5.60
0.041 0.061 1.05 1.55
0.028 0.053 0.70 1.35
0.006 0.010 0.15 0.25
INCHES
Maximum
Instantaneous
Forward Voltage
DIM
NOTE
IF=3.0A;
TJ=25⁰C
1.1V
VF
A
B
C
D
E
F
Maximum DC Reverse
Current At Rated DC
Blocking Voltage
5μA
TJ=25⁰C;
TJ=125⁰C
IR
100μA
G
Typical Junction
Capacitance
Measured at 1.0MHz
VR=4.0V
CJ
25pF
Suggested Solder Pad Layout
2.2mm
4.3mm
Note:
1. Halogen free "Green"products are defined as those which contain <900ppm bromine,
<900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds.
2. High Temperature Solder Exemptions Applied, See EU Directive Annex 7a.
3. Mounted on P.C.B. with 0.3" x 0.3" (8.0 mm x 8.0 mm) copper pad areas.
1.9mm
Rev.3-1-10012021
1/3
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