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S3025 PDF预览

S3025

更新时间: 2024-01-07 21:54:29
品牌 Logo 应用领域
AMCC ATM异步传输模式电信电信集成电路
页数 文件大小 规格书
2页 31K
描述
Clock Recovery Circuit, 1-Func, PQCC16, PLASTIC, LCC-16

S3025 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
零件包装代码:TSSOP包装说明:TSSOP, TSSOP20,.25
针数:20Reach Compliance Code:unknown
HTS代码:8542.39.00.01风险等级:5.87
JESD-30 代码:R-PDSO-G20JESD-609代码:e0
长度:6.5 mm功能数量:1
端子数量:20最高工作温度:70 °C
最低工作温度:封装主体材料:PLASTIC/EPOXY
封装代码:TSSOP封装等效代码:TSSOP20,.25
封装形状:RECTANGULAR封装形式:SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
峰值回流温度(摄氏度):NOT SPECIFIED电源:5 V
认证状态:Not Qualified座面最大高度:1.2 mm
子类别:ATM/SONET/SDH ICs最大压摆率:0.1 mA
标称供电电压:5 V表面贴装:YES
技术:BIPOLAR电信集成电路类型:ATM/SONET/SDH CLOCK RECOVERY CIRCUIT
温度等级:COMMERCIAL端子面层:Tin/Lead (Sn/Pb)
端子形式:GULL WING端子节距:0.65 mm
端子位置:DUAL处于峰值回流温度下的最长时间:NOT SPECIFIED
宽度:4.4 mmBase Number Matches:1

S3025 数据手册

 浏览型号S3025的Datasheet PDF文件第2页 
PRELIMINARY  
REFERENCE DESIGN  
SONET/SDH CLOCK RECOVERY UNIT EVALUATION BOARD  
S3025  
ELECTRICAL CONNECTIONS  
DESCRIPTION  
The S3025 Evaluation Board provides a flexible plat-  
form for verifying the operation of the S3025 clock  
recovery unit. This data sheet provides information on  
board contents and layout. It should be used in con-  
junction with the S3025 data sheet, which contains  
full technical details on chip operation.  
Power Connections  
Terminal posts are provided at the top edge of the  
board allowing separate control of voltage levels for  
the input signal termination, the S3025 itself, the  
S3025 output terminations, and the AC coupled out-  
put buffers.  
The S3025 board is factory configured as “option A”  
allowing control of the serial output clock during inac-  
tive input via the SQELCHN signal (SW2). Option A  
allows operation of the S3025 with the on-board  
12.96 MHz crystal and the internal on-chip oscillator.  
The buffers AC couple and translate between the  
external test equipment environment or other stan-  
dard ECL and/or +5V Referenced ECL systems to  
supply the correct +5V Referenced ECL to the  
device. The separately powered output buffers allow  
easy connection to the 50 Ohm to ground inputs of  
Figure1. Board Layout  
GND DUT  
Vcc  
O/P  
Vtt  
GND  
I/P  
Vtt  
BUF  
Vee  
BUF  
Vcc  
SERDATOP  
SERDATOP  
DIPSWITCH OPTIONS  
SW3  
OPT SW2  
BUF Vcc  
O/P  
Vtt  
SD  
A
SQUELCHN  
50  
.1uF  
SDN  
Bx MODE  
+
-
+
-
SERDATIP  
330  
10EL16  
.1uF  
BUF Vee  
.1uF  
50  
50  
+
-
O/P  
Vtt  
+
-
100  
10EL16  
50  
SERDATON  
SERDATON  
[BUFFERED  
OUTPUTS]  
.1uF  
S3025  
REFCLK  
JUMPER  
SERCLKOP  
SERCLKOP  
330  
SERDATIN  
[BUFFERED INPUTS]  
BUF Vcc  
50  
.1uF  
O/P  
Vtt  
+
+
-
10EL16  
-
.1uF  
BUF Vee  
3 4  
1 2  
50  
O/P  
Vtt  
SERCLKON  
REFCLK I/Px  
(NOT USED)  
SERCLKON  
OFF  
Applied Micro Circuits Corporation  
6195 Lusk Blvd., San Diego, CA 92121 • (619) 450-9333  
October 7, 1996  
Page 1  

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