SPICE MODELS: S2A S2B S2D S2G S2J S2K S2M S2AA S2BA S2DA S2GA S2JA S2KA S2MA
S2A/A - S2M/A
1.5A SURFACE MOUNT GLASS PASSIVATED RECTIFIER
Features
·
·
·
·
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Glass Passivated Die Construction
Low Forward Voltage Drop and High Current Capability
Surge Overload Rating to 50A Peak
SMA
Min
SMB
Min
Dim
B
Ideally Suited for Automated Assembly
Lead Free Finish/RoHS Compliant (Note 3)
Max
2.92
4.60
1.63
0.31
5.59
0.20
1.52
2.62
Max
3.94
4.57
2.21
0.31
5.59
0.20
1.52
2.62
A
B
C
D
E
G
H
J
2.29
4.00
1.27
0.15
4.80
0.10
0.76
2.01
3.30
4.06
1.96
0.15
5.00
0.10
0.76
2.00
A
J
C
D
Mechanical Data
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Case: SMA/SMB
·
Case Material: Molded Plastic. UL Flammability
Classification Rating 94V-0
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·
Moisture Sensitivity: Level 1 per J-STD-020C
Terminals: Lead Free Plating (Matte Tin Finish).
Solderable per MIL-STD-202, Method 208
Polarity: Cathode Band or Cathode Notch
Marking: Type Number, See Page 2
Ordering Information: See Page 2
e
3
G
H
All Dimensions in mm
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·
·
·
E
A Suffix Designates SMA Package
No Suffix Designates SMB Package
Approximate Weight: SMA 0.064 grams
SMB 0.093 grams
@TA = 25°C unless otherwise specified
Maximum Ratings and Electrical Characteristics
Single phase, half wave, 60Hz, resistive or inductive load.
For capacitive load, derate current by 20%.
S2
A/AA
S2
B/BA
S2
D/DA
S2
G/GA
S2
J/JA
S2
K/KA
S2
M/MA
Characteristic
Symbol
Unit
VRRM
VRWM
VR
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
50
100
70
200
140
400
600
420
800
560
1000
700
V
VR(RMS)
RMS Reverse Voltage
35
280
1.5
V
A
Average Rectified Output Current
@ TT = 100°C
I(AV)
IFSM
VFM
Non-Repetitive Peak Forward Surge Current 8.3ms
single half sine-wave superimposed on rated load
50
A
V
Forward Voltage
@ IF = 1.5A
1.15
Peak Reverse Current
@TA 25°C
=
5.0
IRM
µA
pF
at Rated DC Blocking Voltage
@TA = 125°C
125
CT
Typical Total Capacitance (Note 1)
20
20
Typical Thermal Resistance, Junction to Terminal
(Note 2)
RqJT
Tj, TSTG
°C/W
°C
Operating and Storage Temperature Range
-65 to +150
Notes:
1. Measured at 1.0 MHz and applied reverse voltage of 4.0V DC.
2. Thermal Resistance Junction to Terminal, unit mounted on PC board with 5.0 mm (0.013 mm thick) copper pads as heat sink.
3. RoHS revision 13.2.2003. Glass and High Temperature Solder Exemptions Applied, see EU Directive Annex Notes 5 and 7.
2
DS16004 Rev. 11 - 2
1 of 3
S2A/A - S2M/A
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