S29WS-N MirrorBit™ Flash Family
S29WS256N, S29WS128N, S29WS064N
256/128/64 Megabit (16/8/4 M x 16-Bit) CMOS 1.8 Volt-only
Simultaneous Read/Write, Burst Mode Flash Memory
ADVANCE
INFORMATION
Data Sheet
General Description
The Spansion S29WS256/128/064N are MirrorbitTM Flash products fabricated on 110 nm process technology. These burst
mode Flash devices are capable of performing simultaneous read and write operations with zero latency on two separate
banks using separate data and address pins. These products can operate up to 80 MHz and use a single VCC of
1.7 V to 1.95 V that makes them ideal for today’s demanding wireless applications requiring higher density, better per-
formance and lowered power consumption.
Distinctive Characteristics
Single 1.8 V read/program/erase (1.70–1.95 V)
Command set compatible with JEDEC (42.4)
standard
110 nm MirrorBit™ Technology
Hardware (WP#) protection of top and bottom
sectors
Simultaneous Read/Write operation with zero
latency
32-word Write Buffer
Dual boot sector configuration (top and bottom)
Sixteen-bank architecture consisting of 16/8/4
Mwords for WS256N/128N/064N, respectively
Offered Packages
— WS064N: 80-ball FBGA (7 mm x 9 mm)
— WS256N/128N: 84-ball FBGA (8 mm x 11.6 mm)
Four 16 Kword sectors at both top and bottom of
memory array
Low VCC write inhibit
254/126/62 64 Kword sectors (WS256N/128N/
064N)
Persistent and Password methods of Advanced
Sector Protection
Programmable burst read modes
Write operation status bits indicate program and
erase operation completion
— Linear for 32, 16 or 8 words linear read with or
without wrap-around
Suspend and Resume commands for Program and
Erase operations
— Continuous sequential read mode
SecSi™ (Secured Silicon) Sector region consisting
of 128 words each for factory and customer
Unlock Bypass program command to reduce
programming time
20-year data retention (typical)
Synchronous or Asynchronous program operation,
independent of burst control register settings
Cycling Endurance: 100,000 cycles per sector
(typical)
ACC input pin to reduce factory programming time
Support for Common Flash Interface (CFI)
RDY output indicates data available to system
Industrial Temperature range (contact factory)
Performance Characteristics
Read Access Times
Current Consumption (typical values)
Speed Option (MHz)
Max. Synch. Latency, ns (tIACC
Max. Synch. Burst Access, ns (tBACC
Max. Asynch. Access Time, ns (tACC
Max CE# Access Time, ns (tCE
Max OE# Access Time, ns (tOE
80
80
66
80
54
80
Continuous Burst Read @ 66 MHz
35 mA
50 mA
19 mA
19 mA
20 µA
)
Simultaneous Operation (asynchronous)
Program (asynchronous)
)
9
11.2
80
13.5
80
)
80
Erase (asynchronous)
)
80
80
80
Standby Mode (asynchronous)
)
13.5
13.5
13.5
Typical Program & Erase Times
Single Word Programming
40 µs
9.4 µs
6 µs
Effective Write Buffer Programming (VCC) Per Word
Effective Write Buffer Programming (VACC) Per Word
Sector Erase (16 Kword Sector)
150 ms
600 ms
Sector Erase (64 Kword Sector)
Publication Number S29WS-N_00 Revision G Amendment 0 Issue Date January 25, 2005