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S25FL032P0XBHV030 PDF预览

S25FL032P0XBHV030

更新时间: 2024-11-09 12:03:11
品牌 Logo 应用领域
飞索 - SPANSION /
页数 文件大小 规格书
69页 3188K
描述
32-Mbit CMOS 3.0 Volt Flash Memory with 104-MHz SPI (Serial Peripheral Interface) Multi I/O Bus

S25FL032P0XBHV030 技术参数

是否Rohs认证: 符合生命周期:Transferred
零件包装代码:BGA包装说明:TBGA, BGA24,4X6,40
针数:24Reach Compliance Code:unknown
ECCN代码:3A991.B.1.AHTS代码:8542.32.00.51
风险等级:5.6最大时钟频率 (fCLK):104 MHz
数据保留时间-最小值:20耐久性:100000 Write/Erase Cycles
JESD-30 代码:R-PBGA-B24长度:8 mm
内存密度:65536 bit内存集成电路类型:FLASH
内存宽度:16功能数量:1
端子数量:24字数:4096 words
字数代码:4000工作模式:SYNCHRONOUS
最高工作温度:105 °C最低工作温度:-40 °C
组织:4KX16封装主体材料:PLASTIC/EPOXY
封装代码:TBGA封装等效代码:BGA24,4X6,40
封装形状:RECTANGULAR封装形式:GRID ARRAY, THIN PROFILE
并行/串行:SERIAL电源:3/3.3 V
编程电压:3 V认证状态:Not Qualified
座面最大高度:1.2 mm串行总线类型:SPI
最大待机电流:0.00001 A子类别:Flash Memories
最大压摆率:0.038 mA最大供电电压 (Vsup):3.6 V
最小供电电压 (Vsup):2.7 V标称供电电压 (Vsup):3 V
表面贴装:YES技术:CMOS
温度等级:INDUSTRIAL端子形式:BALL
端子节距:1 mm端子位置:BOTTOM
类型:NOR TYPE宽度:6 mm
写保护:HARDWARE/SOFTWARE

S25FL032P0XBHV030 数据手册

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S25FL032P  
32-Mbit CMOS 3.0 Volt Flash Memory  
with 104-MHz SPI (Serial Peripheral Interface) Multi I/O Bus  
Data Sheet  
S25FL032P Cover Sheet  
Notice to Readers: This document states the current technical specifications regarding the Spansion  
product(s) described herein. Each product described herein may be designated as Advance Information,  
Preliminary, or Full Production. See Notice On Data Sheet Designations for definitions.  
Publication Number S25FL032P_00  
Revision 09  
Issue Date January 29, 2013  

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