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S2047B PDF预览

S2047B

更新时间: 2024-09-16 19:42:07
品牌 Logo 应用领域
AMCC 电信电信集成电路
页数 文件大小 规格书
3页 43K
描述
Telecom Circuit, 1-Func, PQFP52, 10 X 10 MM, PLASTIC, QFP-52

S2047B 技术参数

生命周期:Obsolete零件包装代码:QFP
包装说明:QFP, QFP52,.52SQ针数:52
Reach Compliance Code:unknownHTS代码:8542.39.00.01
风险等级:8.46JESD-30 代码:S-PQFP-G52
长度:10 mm功能数量:1
端子数量:52最高工作温度:70 °C
最低工作温度:封装主体材料:PLASTIC/EPOXY
封装代码:QFP封装等效代码:QFP52,.52SQ
封装形状:SQUARE封装形式:FLATPACK
电源:3/5 V认证状态:Not Qualified
座面最大高度:2.45 mm子类别:Digital Transmission Controllers
最大压摆率:160 mA标称供电电压:3.3 V
表面贴装:YES电信集成电路类型:TELECOM CIRCUIT
温度等级:COMMERCIAL端子形式:GULL WING
端子节距:0.65 mm端子位置:QUAD
宽度:10 mmBase Number Matches:1

S2047B 数据手册

 浏览型号S2047B的Datasheet PDF文件第2页浏览型号S2047B的Datasheet PDF文件第3页 
AMCC: Company Information: What's New  
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AMCC'S Gigabit Ethernet Chipset Selected by 3Com for Use in SuperStack II Hub  
1000 SX  
Industry-Leading Transceivers Enable High-Speed Serial Data Transmission in Full-  
Duplex  
SAN DIEGO--June 29, 1998-- Applied Micro Circuits Corp. (AMCC) (NASDAQ: AMCC),  
a leader in high-bandwidth silicon connectivity solutions, today announced that 3Com  
Corp. has selected AMCC's S2046 and S2047 Gigabit Ethernet transmitter and receiver  
pair for use in the company's new SuperStackr II Hub 1000 SX, an 8-port repeater.  
Using AMCC's S2046/S2047 chipset, the SuperStack II Hub 1000 SX is capable of  
simultaneously sending and receiving information at rates of 1000 Mbps, as well as  
forwarding all incoming packets to all ports on the hub in full compliance with the  
proposed IEEE 802.3z specification.  
AMCC's IEEE 802.3z-compliant Gigabit Ethernet transmitter and receiver pair was  
selected for use in the 3Com application based on its superior combination of price, jitter  
performance, and power consumption. With 1250 Mbps operation over fiber optic or  
coaxial cable interfaces, the S2046 and S2047 easily meets the high-speed data  
communications requirements of the SuperStack II Hub 1000 SX, while offering its  
designers a compact 52 PQFP package to work with.  
The S2046/47 chipset's low-power design paved the way for 3Com's development of a  
power-conscious product. Further, the chipset's low jitter output enabled the company's  
design engineers to more easily meet overall system jitter requirements.  
"The SuperStack II Hub 1000 SX delivers a low cost solution to IS Managers seeking to  
increase signal transmission by combining the cost advantages of a hub with the full-  
duplex capability of a switch," said Sung-Min Tao, Senior Product Manager, Advanced  
Products Division for 3Com Corp. "We selected AMCC's chipsets because their superior  
jitter characteristics, excellent performance and low cost fit well within our pricing and  
product design goals for the new SuperStack II Hub 1000 SX."  
"This latest integration speaks of the quality, performance, and cost benefits 3Com has  
reaped from past integration with AMCC's components," said Jack Basi, AMCC's director  
of marketing for datacom and computer products. "We look forward to leveraging the  
functionality of our devices in future 3Com quality networking solutions, while  
strengthening our relationship with the company."  
The SuperStack II Hub 1000 SX is guaranteed to be fully compliant with the final IEEE  
802.3z specification, providing a ready path to future Gigabit Ethernet migrations. The  
new repeater also offers packet flow control to ensure that transmitted data remains  
intact from origin to destination, ultimately reducing packet loss and eliminating the need  
for packet re-transmission. The SuperStack II Hub 1000 SX is designed to meet multiple  
networking requirements including use as a server aggregator, switch aggregator,  
file:///C|/Documents%20and%20Settings/tamerz/Desktop/html/Marvell%20DSP%20Switcher%20MDS-G16%20-%201A%20Switching%20Regulator%20Module.htm (1 of 3)6/28/2005 1:30:51 PM  

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