Multilayer Ceramic Capacitors
AEC-Q200
Approval Sheet
No.
AEC-Q200 Test Condition
Requirements
Test Item
10. Resistance to
Solvents
* Temperature: 25±5°C
* Time: 3+0.5/-0 min.
* No remarkable damage.
* Cap.: within the specified tolerance.
MIL-STD-202
Method 215
* Solvent: Iso-propyl alcohol.
* Q. value: NPO: Cap≥30pF, Q≥1000 ; Cap<30pF, Q≥400+20C.
* I.R.: ≥10GΩ or RxC≥500Ω-F whichever is smaller.
* No remarkable damage.
11. Mechanical Shock * Peak value: 1500g’s.
MIL-STD-202
* Wave: 1/2 sine.
* Cap.: within the specified tolerance.
Method 213
* Velocity: 15.4 ft/sec
* Q. value: NPO: Cap≥30pF, Q≥1000 ; Cap<30pF, Q≥400+20C.
* Three shocks in each direction should be applied * I.R.: ≥10GΩ or RxC≥500Ω-F whichever is smaller.
along
3 mutually perpendicular axes of the test specimen
(18 shocks)
12.
13.
Vibration
* Vibration frequency: 10~2000 Hz/min.
(5g’s for 20 min)
* No remarkable damage.
MIL-STD-202
Method 204
* Cap.: within the specified tolerance.
* Total amplitude: 1.5mm
* Q. value: NPO:Cap≥30pF, Q≥1000 ; Cap<30pF, Q≥400+20C.
* I.R.: ≥10GΩ or RxC≥500Ω-F whichever is smaller.
* No remarkable damage.
* 12 cycles each of 3 orientations (36 times)
* Solder temperature: 270±5°C
* Dipping time: 10±1 sec
Resistance to
Soldering Heat
MIL-STD-202
Method 210
* Cap change: NPO: within ±2.5% or 0.25pF whichever is larger
* Q. value: NPO: Cap≥30pF, Q≥1000 ; Cap<30pF, Q≥400+20C.
* I.R.: ≥10GΩ or RxC≥500Ω-F whichever is smaller.
* Measurement to be made after keeping at room
temp. for 24±2 hrs.
14 Thermal Shock
MIL-STD-202
* Conduct 300 cycles according to the temperatures * No remarkable damage.
and time.
* Cap change:NPO: within ±2.5% or 0.25pF whichever is larger.
Method 107
* Q. value: NPO: Cap≥30pF, Q≥1000 ; Cap<30pF, Q≥400+20C.
* I.R.: ≥10GΩ or RxC≥500Ω-F whichever is smaller.
Step
Temp. (°C)
-55°C +0/-3
+125°C +3/-0
Time (min.)
15±3
1
2
15±3
* Max. transfer time: 20 sec.
* Measurement to be made after keeping at room
temp. for 24±2 hrs.
15.
ESD
Per AEC-Q200-002
* No remarkable damage.
AEC-Q200-002
* Cap.: within the specified tolerance.
* Q. value: NPO: Cap≥30pF, Q≥1000 ; Cap<30pF, Q≥400+20C.
* I.R.: ≥10GΩ or RxC≥500Ω-F whichever is smaller.
All terminations shall exhibit a continuous solder coating free from
16. Solderability
J-STD-002
* Condition A
Un-mounted chips 4hrs / 155°C*dry then completely defects from a minimum of 95% of the critical surface area of any individual
JESD22-B102E
immersed for 5 0.5 sec in solder bath at 245 5°C.
* Condition B
termination.
Un-mounted chips steam 8 hrs then completely
immersed for 10 1sec in solder bath at 220+5/-0°C.
* Condition C
Un-mounted chips steam 8 hrs then completely
immersed for 10 1 sec. in solder bath at 260+0/-5°C.
Page 7 of 11
ASC_Microwave_AECQ200_(RT)
May. 2019