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RK73B2ATTEB435G PDF预览

RK73B2ATTEB435G

更新时间: 2024-09-16 21:09:19
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大兴电工 - KOA /
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RK73B2ATTEB435G 数据手册

 浏览型号RK73B2ATTEB435G的Datasheet PDF文件第2页 
RESISTORS  
TECHNOLOGY OF TOMORROW  
FLAT CHIP  
THICK FILM (5% • 2%)  
GENERAL PURPOSE  
RK73 B  
STRUCTURE  
1
2
3
4
5
6
7
8
9
Ceramic substrate  
Top termination (Ag Pd)  
Bottom termination (Ag Pd)  
Resistive layer  
~ 11  
~ 11  
~ 11  
~ 11  
µm  
µm  
µm  
µm  
Glass layer  
Trimming cut  
Protective layer  
~ 25  
µm  
End termination  
~ 0.05 µm  
3 ~ 12 µm  
3 ~ 12 µm  
Diffusion barrier (Ni)  
10 Solder plating  
IDENTIFICATION  
COATING  
COLOR  
TYPE  
MARKING  
RK73B 1F … RK73B 1E  
RK73B 1J ... RK73B 3A  
None  
White, 3 digits  
Products with Pb-free terminations  
meet RoHS requirements  
Black  
TYPE DESIGNATION (HOW TO ORDER)  
Old Part No.  
RK73K  
1J  
G
TD  
TD  
10K  
103  
New Part No.  
(Pb-free)  
RK73B  
1J  
T
G
TERMINATION  
SURFACE MATERIAL  
T: Sn L: Sn/Pb  
(G: Au)  
NOMINAL  
RESISTANCE  
3 digits  
TOLERANCE  
PRODUCT CODE  
TOLERANCE  
TAPING*  
STYLE  
1F…3A  
J: 5ꢀ  
G: 2ꢀ  
*Please see “PACKAGING”  
FEATURES  
DIMENSIONS (mm)  
RuO2 thick film resistor element  
SIZE  
TYPE  
L
W
c
d
t
Anti-leaching nickel barrier terminations  
01005  
0201  
RK73 1F**  
RK73 1H  
0.4  
0.6  
0.02 0.2  
0.03 0.3  
0.02 0.1 0.03 0.1  
0.03 0.1 0.05 0.15 0.05 0.23 0.03  
0.05 0.2 0.1  
0.03 0.12 0.02  
Excellent heat resistance and moisture resistance are  
ensured by the use of metal glaze thick film  
Also available with expoxy bondable, silver-palladium  
inner terminations in 1J, 2A and 2B sizes (see RK73X series)  
Also available with gold plated electrodes in size 1E, 1J and  
2A (10…1M)  
+
0.1  
+
0.05  
0402  
0603  
0805  
1206  
1210  
2010  
2512  
RK73 1E  
RK73 1J  
RK73 2A  
RK73 2B  
RK73 2E  
RK73 2H  
RK73 3A  
1.0  
1.6  
2.0  
0.5  
0.25  
0.3  
0.3  
0.35 0.05  
0.45 0.1  
0.1  
0.05  
0.2  
0.2  
0.8  
0.1  
0.3 0.1  
0.4 0.2  
0.1  
+
0.2  
1.25 0.1  
0.5  
0.1  
0.1  
Rated ambient temperature: +70° C  
Taping according to IEC-60 286-3  
Meets or exceeds IEC 60 115, CECC 40 401-802, EIAJ RC-2134A  
Suitable for reflow and wave soldering  
Lab Kit available  
1.6  
2.6  
2.5  
3.1  
0.2  
0.2  
0.2  
0.2  
+
0.2  
0.1  
3.2  
0.2  
0.4  
0.5 0.3  
0.6  
0.1  
5.0  
6.3  
0.2  
0.2  
+
0.2  
0.1  
0.4  
(0.65 0.15)*  
* Time of change to (0.65 0.15) will be announced by PCN.  
RATING  
MAX.  
MAX.  
OPERATING  
TEMPERATURE  
RANGE  
RESISTANCE RANGE (E24)  
T.C.R.  
POWER*  
RATING  
SIZE  
TYPE  
WORKING OVERLOAD  
(ppm/K)  
G ( 2%)  
10 … 1MΩ  
J ( 5%)  
10 … 1 MΩ  
1 … 9.1 Ω  
VOLTAGE  
VOLTAGE  
30 V  
01005  
RK73B 1F**  
250  
0.03 W  
15 V  
U N D E R D E V E L O P M E N T  
400  
200  
400  
200  
400  
200  
400  
200  
400  
200  
400  
200  
400  
200  
400  
200  
- 55° C … + 125° C*  
NEW 0201  
RK73B 1H  
0.05 W  
0.063 W  
0.1 W  
25 V  
50 V  
100 V  
200 V  
10 … 10 MΩ  
10 … 10 MΩ  
1 . . . 9.1 Ω  
0402  
RK73B 1E  
10 … 10 MΩ  
1 . . . 9.1 Ω  
10 … 10 MΩ  
10 … 10 MΩ  
50 V  
1 . . . 9.1 Ω  
11 M. . . 22 MΩ  
0603  
0805  
1206  
1210  
2010  
2512  
RK73B 1J  
RK73B 2A  
RK73B 2B  
RK73B 2E  
10 … 10 MΩ  
1 . . . 9.1 Ω  
1 . . . 9.1 Ω  
1.1 M. . . 10 MΩ  
1.1 M. . . 10 MΩ  
0.125 W  
0.25 W  
150 V  
10 … 1 MΩ  
10 … 1 MΩ  
1 . . . 9.1 Ω  
6.2 M. . . 22 MΩ  
1 . . . 9.1 Ω  
- 55° C . . . +155° C*  
6.2 M. . . 10 MΩ  
10 … 5.6 MΩ  
10 … 5.6 MΩ  
1 . . . 9.1 Ω  
0.5 W  
0.33 W  
0.5 W  
6.2 M. . . 10 MΩ  
200 V  
10 . . . 1 kΩ  
10 . . . 1 kΩ  
0.33 W  
1.1 k. . . 5.6 MΩ  
1.1 k. . . 5.6 MΩ  
400 V  
1 . . . 9.1 Ω  
6.2 M. . . 22 MΩ  
0.75 W  
1 W  
RK73B 2H  
RK73B 3A  
10 … 5.6 MΩ  
10 … 5.6 MΩ  
6.2 M. . . 22 MΩ  
1 . . . 9.1 Ω  
200 V  
(500 V)**  
10 … 5.6 MΩ  
10 … 5.6 MΩ  
Care should be taken that RK73B1F may be damaged when static electricity  
occours and is applied in the equipment assembly process  
*
Please note derating diagram  
** Under development  
EUROPE GmbH • Kaddenbusch 6 • D-25578 Dägeling / ITZEHOE • PHONE: +49 (0) 48 21/89 89-0 • FAX: +49 (0) 48 21/89 89 89 • Internet: www.koaeurope.de  
Revision: 5. Nov. 2004  

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