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RB551V-30_12 PDF预览

RB551V-30_12

更新时间: 2024-11-01 07:17:59
品牌 Logo 应用领域
上华 - COMCHIP 二极管
页数 文件大小 规格书
4页 96K
描述
SMD Schottky Barrier Diodes

RB551V-30_12 数据手册

 浏览型号RB551V-30_12的Datasheet PDF文件第2页浏览型号RB551V-30_12的Datasheet PDF文件第3页浏览型号RB551V-30_12的Datasheet PDF文件第4页 
SMD Schottky Barrier Diodes  
RB551V-30  
Io = 500 mA  
VR = 20 Volts  
RoHS Device  
SOD-323  
Features  
-Low reverse current.  
0.071(1.80)  
0.063(1.60)  
-Designed for mounting on small surface.  
-Extremely thin / leadless package.  
-Majority carrier conduction.  
0.055(1.40)  
0.047(1.20)  
0.014(0.35)  
0.010(0.25)  
0.106(2.70)  
0.098(2.50)  
Mechanical data  
-Case: SOD-323 Standard package,  
molded plastic.  
-Terminals: Gold plated, solderable per  
MIL-STD-750D, method 2026.  
0.039(1.00)Max.  
0)  
0.006(0.15)Max.  
0.004(0.10)Max.  
0)  
-Mounting position: Any.  
0.019(0.475)REF  
Dimensions in inches and (millimeter)  
Maximum Ratings (at TA=25°C unless otherwise noted)  
Symbol  
VRRM  
Typ  
Max Unit  
Parameter  
Repetitive peak reverse voltage  
Conditions  
Min  
30  
V
Reverse voltage  
VR  
20  
V
Average forward current  
IO  
500  
2
mA  
A
8.3ms single half sine-wave superimposed  
on rate load(JEDEC method)  
Forward current,surge peak  
IFSM  
Storage temperature  
Junction temperature  
TSTG  
Tj  
-40  
+125  
+125  
°C  
°C  
Electrical Characteristics (At Ta=25°C, unless otherwise noted)  
Symbol  
Typ  
Max Unit  
Parameter  
Forward voltage  
Conditions  
Min  
IF = 100 mA  
IF = 500 mA  
0.36  
V
VF  
0.47  
Reverse current  
VR = 20 V  
IR  
100  
uA  
REV:B  
Page 1  
QW-BB026  
Comchip Technology CO., LTD.  

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