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R5F212G5SDFP PDF预览

R5F212G5SDFP

更新时间: 2024-11-02 09:40:07
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瑞萨 - RENESAS /
页数 文件大小 规格书
344页 3228K
描述
MCU

R5F212G5SDFP 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Not Recommended零件包装代码:QFP
包装说明:LQFP, QFP32,.35SQ,32针数:32
Reach Compliance Code:compliantHTS代码:8542.31.00.01
风险等级:5.51具有ADC:NO
其他特性:ALSO OPERATES AT 2.2 V AT 4 MHZ地址总线宽度:
位大小:8最大时钟频率:8 MHz
DAC 通道:NODMA 通道:NO
外部数据总线宽度:JESD-30 代码:S-PQFP-G32
长度:7 mm湿度敏感等级:3
I/O 线路数量:28端子数量:32
最高工作温度:85 °C最低工作温度:-40 °C
PWM 通道:NO封装主体材料:PLASTIC/EPOXY
封装代码:LQFP封装等效代码:QFP32,.35SQ,32
封装形状:SQUARE封装形式:FLATPACK, LOW PROFILE
峰值回流温度(摄氏度):260电源:2.2/5.5 V
认证状态:Not QualifiedRAM(字节):1024
ROM(单词):24576ROM可编程性:FLASH
座面最大高度:1.7 mm速度:8 MHz
子类别:Microcontrollers最大压摆率:8 mA
最大供电电压:5.5 V最小供电电压:2.7 V
标称供电电压:5 V表面贴装:YES
技术:CMOS温度等级:INDUSTRIAL
端子形式:GULL WING端子节距:0.8 mm
端子位置:QUAD处于峰值回流温度下的最长时间:20
宽度:7 mmuPs/uCs/外围集成电路类型:MICROCONTROLLER
Base Number Matches:1

R5F212G5SDFP 数据手册

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REJ09B0387-0100  
R8C/2G Group  
Hardware Manual  
16  
RENESAS MCU  
R8C FAMILY / R8C/2x SERIES  
All information contained in these materials, including products and product specifications,  
represents information on the product at the time of publication and is subject to change by  
Renesas Technology Corp. without notice. Please review the latest information published  
by Renesas Technology Corp. through various means, including the Renesas Technology  
Corp. website (http://www.renesas.com).  
Rev.1.00  
Revision Date: Apr 04, 2008  
www.renesas.com