Circuit Board Materials
電子回路基板材料
Highly heat resistant Low CTE
Multi-layer circuit board materials <High-Tg type>
高耐熱・低熱膨張多層基板材料 <High-Tgタイプ>
Laminate R-1755V
Prepreg R-1650V
Applications ⽤途
ICT infrastructure equipment, Measuring instrument, Etc.
ICT インフラ機器、計測機器など
Network
ネットワーク
Good for hybrid board with MEGTRON series. Standard loss material.
スタンダード領域の伝送ロスを有しており、MEGTRON シリーズとのハイブリットが可能
Dk 4.4 Df 0.016
@1GHz
Tg (DSC)
173℃
T288 (with copper)
20min
■ IST (Interconnect Stress Test)
●Result
■ Solder heat resistance (float)ꢀはんだフロート耐熱性
●Result
R-1755V : No abnormality of cross-sectional observation
Sample No.
Reflow condition
R-1755V
●Condition
288℃ 10sec. Solder float 6 cycles
1
2
3
4
5
-
Over 1000 cycles OK
Over 1000 cycles OK
Over 1000 cycles OK
Over 1000 cycles OK
Over 1000 cycles OK
230℃ x 3times
230℃ x 6times
260℃ x 3times
260℃ x 6times
●Construction
Board thickness
Layer count
3.1mm
24 layers
●Condition
●Construction
Drill diameter/Pitch
0.25 mmφ/0.76mm
Pretreatment
Reflow
Board thickness
2.1mm
Number of layers 18 layers
25℃
(2min)
150℃
⇔
Cycle condition
(3min)
* Failure is over 10% changes of resistance
What is IST ?
IST Coupon
Carrying out temperature cycling
experiments 25℃ ⇔ 150℃ by
electric heating to the power unit.
By detecting the occurrence of
deficiencies in the sense unit,
evaluating the number of cycles to
failure occurrences.
Core 0.1mm
Power
Prepreg #2116 53% 1ply
Sense
■ General propertiesꢀ⼀般特性
Item
Test method
DSC
Condition
A
Unit
℃
R-1755V
173
44
Glass transition temp.(Tg)
α1
CTE z-axis
α2
IPC-TM-650 2.4.24
IPC-TM-650 2.4.24.1
IPC-TM-650 2.5.5.9
IPC-TM-650 2.4.8
A
ppm/℃
min
255
20
T288 (with copper)
A
C-24/23/50
A
Dielectric constant (Dk)
1GHz
4.4
-
Dissipation factor (Df)
0.016
1.5
Peel strength
1oz(35μm)
kN/m
The sample thickness is 0.8mm.
The above data are typical values and not guaranteed values. 上記データは当社測定による代表値であり、保証値ではありません。
Please see the page for “Notes before you use” 商品のご採用に当たっての注意事項は こちら
2019
201906
industrial.panasonic.com/ww/electronic-materials
panasonic R-1755V