CTI≥600V
Double-sided copper clad
R-1786
Insulation reliability
Low dielectric property
Single-sided copper clad
R-1781
Glass composite circuit board materials
Applications
Excellent tracking resistance (CTI ≥600V), excellent CAF
resistance and excellent thickness accuracy. Reduces CO₂
emission amount in our manufacturing process to one-
quarter by our unique manufacturing process. (Compared
with our conventional FR-4 (R-1705))
Appliance/Industry/Wireless
Home Appliance, Digital Appliance, LED Lighting,
Meter Panel, Power Supply System Board, Amusement
Machine, Antenna (5G Terminal/Equipment), etc.
Tracking resistance
Low dielectric property
Measured by Panasonic with IPC-TM-650 2.5.5.9
Appearance of the test piece
Standard state After test
(1.6t：@1GHz)
Pattern method Product name
CEM-3
5.0
4.5
4.0
3.5
IEC method
R-1787
FR-4
(circuit method)
175
/ number
R-1705
Lower Df
CEM-3
Conventional FR-4
600
R-1786
Conventional CEM-3
CEM-3
CEM-3
Conventional
R-1786
R-1785
-
FR-4
240
R-1705
3.0
0.004
0.008
0.012
0.016
Dissipation factor (Df)
Test method
The above data are our company measurement values and not guaranteed values.
Drip 50 drops electrolyte
(0.1% aqueous solution of
ammonium chloride)
towards the central
Test piece
Test piece(Overall etching)
General properties
Drop out
Drop out
4±60.01m° m
circuit current of 1.0A
flows in the voltage of
100V ~ 600V (25V interval).
Measure the voltage
current flows for more
than 2 seconds.
Item
Condition
Unit
R-1786
Electrode Copper foil
circuit
Platinum
electrode
Tg
Temp. rising rate:10
℃
/min
℃
-
140
No abnormality
240℃ 60min
4.0
Solder heat resistance 260℃ solder float for 2min
1mm
1mm
Circuit interval
Circuit interval
Heat resistance 1oz
A
-
Dk*
1GHz
Df*
C-24/23/50
－
CAF resistance
Evaluation condition
0.007
1×10⁸
5×10⁷
3×10⁸
1×10⁸
5×10⁸
1×10⁷
280
1.E+11
85℃, 85%,
Test condition
100V applied voltage
C-96/20/65
C-96/20/65+C-96/40/90
C-96/20/65
1.E+10
R-1786
Wall to wall
0.45mm
distance
Volume resistivity
Surface resistivity
MΩ-m
MΩ
1.E+09
Drill diameter
Test method
Board
Φ0.9~Φ0.35
1.E+08
1.E+07
Continuous
measurement in a tank
C-96/20/65+C-96/40/90
C-96/20/65
Threshold
500
Our test pattern
1.E+06
1.E+05
Insulation resistance
Flexural strength Fill
MΩ
Warp direction
60 hole
C-96/20/65+D-2/100
A
0
1000
1500
2000
Fill
60 hole
Time (h)
direction
N/mm²
A
1.37
1.37
1.76
1.76
Board thickness accuracy
Copper foil: 0.018mm
Board thickness: 1.6mm
(18μm)
S₄
Copper foil thickness: 0.018mm
R-1786
Peel strength
Flammability
N/mm
-
150
100
50
Conventional
FR-4
A
Copper foil: 0.035mm
(35μm)
R-1705
S₄
x=1.52mm
R=0.053mm
V =0.014mm
A+E-168/70
94V-0
0
The sample thickness is 1.6mm.
1.45
1.50
1.55
<Test method> JIS C 6481 * IPC-TM-650 2.5.5.9
Board thickness (mm)
Please see our website for Notes before you use.ꢀ
industrial.panasonic.com/ww/electronic-materials
Panasonic Industry R-1786 R-1781
The above data are typical values and not guaranteed values.
Panasonic Industry Co., Ltd. Electronic Materials Business Division
Ⓒ Panasonic Industry Co., Ltd.ꢀ202212
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