PEMB24; PUMB24
Philips Semiconductors
PNP/PNP resistor-equipped transistors; R1 = 100 kΩ, R2 = 100 kΩ
5. Limiting values
Table 6:
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
Min
Max
Unit
Per transistor
VCBO
VCEO
VEBO
VI
collector-base voltage
open emitter
open base
-
-
-
−50
−50
−10
V
V
V
collector-emitter voltage
emitter-base voltage
input voltage
open collector
positive
-
-
-
-
+10
−40
−20
−100
V
negative
V
IO
output current (DC)
peak collector current
total power dissipation
SOT363
mA
mA
ICM
Ptot
Tamb ≤ 25 °C
[1]
-
200
mW
mW
°C
[1] [2]
SOT666
-
200
Tstg
storage temperature
junction temperature
ambient temperature
−65
-
+150
150
Tj
°C
Tamb
−65
+150
°C
Per device
Ptot
total power dissipation
SOT363
Tamb ≤ 25 °C
[1]
-
-
300
300
mW
mW
[1] [2]
SOT666
[1] Device mounted on an FR4 printed-circuit board, single-sided copper, standard footprint.
[2] Reflow soldering is the only recommended soldering method.
6. Thermal characteristics
Table 7:
Symbol
Per transistor
Thermal characteristics
Parameter
Conditions
Min
Typ
Max Unit
Rth(j-a)
thermal resistance from
Tamb ≤ 25 °C
junction to ambient
[1]
SOT363
-
-
-
-
625
625
K/W
K/W
[1] [2]
SOT666
Per device
Rth(j-a)
thermal resistance from
junction to ambient
Tamb ≤ 25 °C
[1]
SOT363
SOT666
-
-
-
-
416
416
K/W
K/W
[1] [2]
[1] Device mounted on an FR4 printed-circuit board, single-sided copper, standard footprint.
[2] Reflow soldering is the only recommended soldering method.
9397 750 14368
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet
Rev. 01 — 18 February 2005
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