PS22 thru PS24
Surface Mount Schottky Rectifier
Reverse Voltage 20~40V Forward Current 2A
Features
• Heatsink structure
• Low profile, typical thickness 0.8mm
• Super Low VF Schottky barrier diodes
• Moisture sensitivity: level 1, per J-STD-020
iSGA
(SOD-123HS)
• High temperature soldering guaranteed: 260℃/10 seconds
Typical Applications
For use of fast swiching in RF module, lighting, cellular phone, portable device, power supplies
and other consumer applications.
Maximum Ratings (TA = 25 °C unless otherwise noted)
PS22
PS23
PS24
Unit
Parameter
Symbol
20
14
20
30
21
30
2.0
40
28
40
Maximum repetitive peak reverse voltage
Maximum RMS voltage
Maximum DC blocking voltage
Maximum average forward rectified current
Peak forward surge current 8.3 ms single half sine-
wave superimposed on rated load
V
V
V
A
VRRM
VRMS
VDC
IF(AV)
50
A
IFSM
A2sec
°C
I2t
TJ
10
Rating for fusing(t<8.3ms)
- 55 to + 150
- 55 to + 150
Operating junction temperature range
Storage temperature range
TSTG
°C
Electrical Characteristics (TA = 25 °C unless otherwise noted)
PS22
PS23
PS24
Unit
Parameter
Test Conditions Symbol
20
30
0.51
0.45
50
40
VBR
VF
Ta=25℃,IR=1mA
IF=2A,Ta=25℃
IF=2A,Ta=125℃
Ta=25℃
Minimum Breakdown voltage
Volts
Maximum instantaneous
forward voltage
VF
uA
mA
pF
Maximum DC reverse current
at rated DC blocking voltage
IR
10
Ta=125℃
115
CJ
Typical junction capacitance
Typical thermal resistance
4.0 V, 1 MHz
1)
60
6
juntion to ambient
juntion to lead
RθJA
RθJL
1)
2)
℃/W
28
juntion to case
RθJC
Note:1),The thermal resistance from junction to ambient or lead, mounted on P.C.B with 5×5mm copper pads,2 OZ,FR4 PCB
2),The thermal resistance from junction to case, mounted on P.C.B with recommended copper pads,2 OZ,FR4 PCB
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2016.04-Rev.A