是否无铅: | 不含铅 | 是否Rohs认证: | 符合 |
生命周期: | Active | 零件包装代码: | QFP |
包装说明: | TFQFP, TQFP100,.63SQ | 针数: | 100 |
Reach Compliance Code: | compliant | ECCN代码: | 3A991.A.2 |
HTS代码: | 8542.31.00.01 | Factory Lead Time: | 16 weeks |
风险等级: | 0.86 | Samacsys Confidence: | 3 |
Samacsys Status: | Released | Samacsys PartID: | 160248 |
Samacsys Pin Count: | 100 | Samacsys Part Category: | Integrated Circuit |
Samacsys Package Category: | Quad Flat Packages | Samacsys Footprint Name: | 100-Lead Plastic Thin Quad Flatpack (PF) – 14x14x1 mm Body |
Samacsys Released Date: | 2015-04-16 09:48:08 | Is Samacsys: | N |
具有ADC: | YES | 其他特性: | ALSO OPERATES AT 2V MINIMUM SUPPLY AT 4 MHZ |
地址总线宽度: | 20 | 位大小: | 16 |
CPU系列: | PIC | 最大时钟频率: | 41.6667 MHz |
DAC 通道: | NO | DMA 通道: | NO |
外部数据总线宽度: | 16 | JESD-30 代码: | S-PQFP-G100 |
JESD-609代码: | e3 | 长度: | 14 mm |
湿度敏感等级: | 3 | I/O 线路数量: | 70 |
端子数量: | 100 | 最高工作温度: | 85 °C |
最低工作温度: | -40 °C | PWM 通道: | YES |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | TFQFP |
封装等效代码: | TQFP100,.63SQ | 封装形状: | SQUARE |
封装形式: | FLATPACK, THIN PROFILE, FINE PITCH | 峰值回流温度(摄氏度): | 260 |
电源: | 2.5,2.5/3.3 V | 认证状态: | Not Qualified |
RAM(字节): | 3808 | ROM(单词): | 131072 |
ROM可编程性: | FLASH | 座面最大高度: | 1.2 mm |
速度: | 41.6667 MHz | 子类别: | Microcontrollers |
最大压摆率: | 21.6 mA | 最大供电电压: | 3.6 V |
最小供电电压: | 2.35 V | 标称供电电压: | 2.5 V |
表面贴装: | YES | 技术: | CMOS |
温度等级: | INDUSTRIAL | 端子面层: | Matte Tin (Sn) - annealed |
端子形式: | GULL WING | 端子节距: | 0.5 mm |
端子位置: | QUAD | 处于峰值回流温度下的最长时间: | 40 |
宽度: | 14 mm | uPs/uCs/外围集成电路类型: | MICROCONTROLLER |
Base Number Matches: | 1 |
型号 | 品牌 | 替代类型 | 描述 | 数据表 |
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暂无描述 | |
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