是否无铅: | 不含铅 | 是否Rohs认证: | 符合 |
生命周期: | Active | 零件包装代码: | QFP |
包装说明: | TFQFP, TQFP100,.55SQ,16 | 针数: | 100 |
Reach Compliance Code: | compliant | ECCN代码: | 3A991.A.2 |
HTS代码: | 8542.31.00.01 | Factory Lead Time: | 5 weeks |
风险等级: | 1.08 | 具有ADC: | YES |
其他特性: | ALSO OPERATES AT 2V MINIMUM SUPPLY AT 4 MHZ | 地址总线宽度: | 20 |
位大小: | 16 | CPU系列: | PIC |
最大时钟频率: | 25 MHz | DAC 通道: | NO |
DMA 通道: | NO | 外部数据总线宽度: | 16 |
JESD-30 代码: | S-PQFP-G100 | JESD-609代码: | e3 |
长度: | 12 mm | 湿度敏感等级: | 3 |
I/O 线路数量: | 70 | 端子数量: | 100 |
最高工作温度: | 85 °C | 最低工作温度: | -40 °C |
PWM 通道: | YES | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | TFQFP | 封装等效代码: | TQFP100,.55SQ,16 |
封装形状: | SQUARE | 封装形式: | FLATPACK, THIN PROFILE, FINE PITCH |
峰值回流温度(摄氏度): | 260 | 电源: | 2.5,2.5/3.3 V |
认证状态: | Not Qualified | RAM(字节): | 3808 |
ROM(单词): | 131072 | ROM可编程性: | FLASH |
座面最大高度: | 1.2 mm | 速度: | 41.6667 MHz |
子类别: | Microcontrollers | 最大压摆率: | 21.6 mA |
最大供电电压: | 3.6 V | 最小供电电压: | 2.7 V |
标称供电电压: | 3 V | 表面贴装: | YES |
技术: | CMOS | 温度等级: | INDUSTRIAL |
端子面层: | Matte Tin (Sn) - annealed | 端子形式: | GULL WING |
端子节距: | 0.4 mm | 端子位置: | QUAD |
处于峰值回流温度下的最长时间: | 40 | 宽度: | 12 mm |
uPs/uCs/外围集成电路类型: | MICROCONTROLLER | Base Number Matches: | 1 |
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