是否无铅: | 不含铅 | 是否Rohs认证: | 符合 |
生命周期: | Active | 零件包装代码: | QFP |
包装说明: | 12 X 12 MM, 1 MM HEIGHT, LEAD FREE, PLASTIC, MS-026, TQFP-100 | 针数: | 100 |
Reach Compliance Code: | compliant | ECCN代码: | 3A991.A.2 |
HTS代码: | 8542.31.00.01 | Factory Lead Time: | 5 weeks |
风险等级: | 1.07 | Samacsys Confidence: | 3 |
Samacsys Status: | Released | Samacsys PartID: | 160249 |
Samacsys Pin Count: | 100 | Samacsys Part Category: | Integrated Circuit |
Samacsys Package Category: | Quad Flat Packages | Samacsys Footprint Name: | 100-(PT) Quad Flatpack |
Samacsys Released Date: | 2015-04-16 09:48:08 | Is Samacsys: | N |
具有ADC: | YES | 其他特性: | ALSO OPERATES AT 2V MINIMUM SUPPLY AT 4 MHZ |
地址总线宽度: | 20 | 位大小: | 16 |
CPU系列: | PIC | 最大时钟频率: | 25 MHz |
DAC 通道: | NO | DMA 通道: | NO |
外部数据总线宽度: | 16 | JESD-30 代码: | S-PQFP-G100 |
JESD-609代码: | e3 | 长度: | 12 mm |
湿度敏感等级: | 3 | I/O 线路数量: | 70 |
端子数量: | 100 | 最高工作温度: | 85 °C |
最低工作温度: | -40 °C | PWM 通道: | YES |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | TFQFP |
封装等效代码: | TQFP100,.55SQ,16 | 封装形状: | SQUARE |
封装形式: | FLATPACK, THIN PROFILE, FINE PITCH | 峰值回流温度(摄氏度): | 260 |
电源: | 2.5,2.5/3.3 V | 认证状态: | Not Qualified |
RAM(字节): | 3808 | ROM(单词): | 131072 |
ROM可编程性: | FLASH | 筛选级别: | TS 16949 |
座面最大高度: | 1.2 mm | 速度: | 41.6667 MHz |
子类别: | Microcontrollers | 最大压摆率: | 21.6 mA |
最大供电电压: | 3.6 V | 最小供电电压: | 2.7 V |
标称供电电压: | 3 V | 表面贴装: | YES |
技术: | CMOS | 温度等级: | INDUSTRIAL |
端子面层: | Matte Tin (Sn) - annealed | 端子形式: | GULL WING |
端子节距: | 0.4 mm | 端子位置: | QUAD |
处于峰值回流温度下的最长时间: | 40 | 宽度: | 12 mm |
uPs/uCs/外围集成电路类型: | MICROCONTROLLER | Base Number Matches: | 1 |
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