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PI3012A PDF预览

PI3012A

更新时间: 2024-11-06 06:00:31
品牌 Logo 应用领域
AMI 传感器
页数 文件大小 规格书
7页 665K
描述
300DPI CIS Sensor Chip

PI3012A 数据手册

 浏览型号PI3012A的Datasheet PDF文件第2页浏览型号PI3012A的Datasheet PDF文件第3页浏览型号PI3012A的Datasheet PDF文件第4页浏览型号PI3012A的Datasheet PDF文件第5页浏览型号PI3012A的Datasheet PDF文件第6页浏览型号PI3012A的Datasheet PDF文件第7页 
Peripheral  
Imaging  
Corporation  
PI3012A  
300DPI CIS Sensor Chip  
Engineering Data Sheet  
Description:  
Peripheral Imaging Corporation PI3012A CIS sensor chip is a 300 dot per inch resolution  
linear array image sensor chip which utilizes PIC’s proprietary CMOS Image Sensing  
Technology. This image sensor is to be used for butting end-to-end on a printed circuit board  
(PCB) using chip-on-board technology to form a scanning array with various lengths.  
Applications for the sensor array are facsimile, scanner, check reader, and office automation  
equipment.  
Figure 1 is a block diagram of the sensor chip. Each sensor chip consists of 96 detector elements,  
8080µm  
1
3
ROW OF 96 SENSORS  
AND VIDEO SIGNAL  
LINE MULTIPLEXER  
2
4
93  
94  
95  
96  
380µm  
READOUT SHIFT REGISTER  
CHIP  
SELECT  
BUFFER  
SP  
BUFFER  
BUFFER  
EOS  
VDD  
DGND  
IOUT  
CP  
PI3012A SENSOR CHIP  
FIGURE 1 BLOCK DIAGRAM  
their associated multiplexing switches, buffers, and a chip selector. The detector element-to-element  
spacing is approximately 84.6 µm. The size of each chip without scribe lines is 8080 µm by 380 µm.  
Each sensor chip has 6 bonding pads. The pad symbols and functions are described in Table 1.  
PAGE 1 of 7 PI3012A6, 6/9/99  

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