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PI3039 PDF预览

PI3039

更新时间: 2024-11-06 06:00:31
品牌 Logo 应用领域
AMI 传感器图像传感器
页数 文件大小 规格书
10页 604K
描述
600DPI CIS Image Sensor Chip

PI3039 数据手册

 浏览型号PI3039的Datasheet PDF文件第2页浏览型号PI3039的Datasheet PDF文件第3页浏览型号PI3039的Datasheet PDF文件第4页浏览型号PI3039的Datasheet PDF文件第5页浏览型号PI3039的Datasheet PDF文件第6页浏览型号PI3039的Datasheet PDF文件第7页 
Peripheral  
Imaging  
Corporation  
PI3039  
600DPI CIS Image Sensor Chip  
Engineering Data Sheet  
Description:  
Peripheral Imaging Corporation PI3039 CIS (Contact Image Sensor) sensor chip is a linear  
array image sensor chip with a 600 elements per inch resolution. The sensor chip is fabricated  
with PIC’s proprietary CMOS Image Sensing Technology. Since this image sensor chip is  
intended for CIS module applications, multiple numbers of these sensors will be serially  
cascaded to form a linear scanning image array of arbitrary length. These sensors are butted  
end-to-end on a printed circuit board (PCB). The sensors are mounted using the chip-on-  
board technology to form scanning arrays with various lengths  
8080 µm  
1
189  
2
3
4
190  
191  
192  
ROW OF 192 SENSORS  
AND VIDEO SIGNAL  
LINE MULTIPLEXER  
360 µm  
READ OUT SHIFT REGISTER  
CHIP  
SELECT  
BUFFER  
BUFFER  
SP  
BUFFER  
CP  
EOS  
VDD  
VSS  
IOUT  
Figure 1. PI3039 Sensor Block Diagram  
Figure 1 is a block diagram of the sensor chip. Each sensor chip consists of 192 detector elements,  
their associated multiplexing switches, buffer amplifiers, and a chip selector. The detector's element-  
to-element spacing is approximately 42µm. The size of each chip without the scribe lines is 8080 µm  
by 360 µm. Each sensor chip has 6 bonding pads. The pad symbols and functions are described in  
Table 1.  
Page 1 of 10, PI3039, 12/2/02  

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