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PHC21025/T3 PDF预览

PHC21025/T3

更新时间: 2024-01-21 21:23:17
品牌 Logo 应用领域
恩智浦 - NXP 开关光电二极管晶体管
页数 文件大小 规格书
16页 240K
描述
TRANSISTOR 3500 mA, 30 V, 2 CHANNEL, N AND P-CHANNEL, Si, SMALL SIGNAL, MOSFET, MS-012AA, PLASTIC, MS-012, SOP-8, FET General Purpose Small Signal

PHC21025/T3 技术参数

生命周期:Obsolete包装说明:SMALL OUTLINE, R-PDSO-G8
Reach Compliance Code:compliant风险等级:5.67
配置:SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE最小漏源击穿电压:30 V
最大漏极电流 (ID):3.5 A最大漏源导通电阻:0.1 Ω
FET 技术:METAL-OXIDE SEMICONDUCTORJEDEC-95代码:MS-012AA
JESD-30 代码:R-PDSO-G8元件数量:2
端子数量:8工作模式:ENHANCEMENT MODE
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:SMALL OUTLINE极性/信道类型:N-CHANNEL AND P-CHANNEL
表面贴装:YES端子形式:GULL WING
端子位置:DUAL晶体管应用:SWITCHING
晶体管元件材料:SILICONBase Number Matches:1

PHC21025/T3 数据手册

 浏览型号PHC21025/T3的Datasheet PDF文件第2页浏览型号PHC21025/T3的Datasheet PDF文件第3页浏览型号PHC21025/T3的Datasheet PDF文件第4页浏览型号PHC21025/T3的Datasheet PDF文件第6页浏览型号PHC21025/T3的Datasheet PDF文件第7页浏览型号PHC21025/T3的Datasheet PDF文件第8页 
PHC21025  
NXP Semiconductors  
Complementary intermediate level FET  
5. Thermal characteristics  
Table 5.  
Symbol  
Rth(j-sp)  
Thermal characteristics  
Parameter  
Conditions  
Min  
Typ  
Max  
Unit  
thermal resistance from junction to solder  
point  
-
-
35  
K/W  
mbe152  
2
10  
R
(K/W)  
th j-s  
δ =  
0.75  
0.5  
0.33  
10  
0.2  
0.1  
0.05  
t
p
P
1
δ =  
0.02  
0.01  
T
0
t
t
p
T
p
1  
10  
10  
6  
5  
4  
3  
2  
1  
10  
10  
10  
10  
10  
1
t
(s)  
Fig 4. Transient thermal impedance from junction to solder point as a function of pulse duration  
PHC21025  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2011. All rights reserved.  
Product data sheet  
Rev. 04 — 17 March 2011  
5 of 16  

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