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PACDN2408C PDF预览

PACDN2408C

更新时间： 2024-11-10 22:44:35
品牌 Logo 应用领域
CALMIRCO /
页数 文件大小 规格书
3页 749K
描述
ESD PROTECTION ARRAYS, 8 CHANNEL, CHIP SCALE PACKAGE

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中文翻译

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PACDN2408C 技术参数

是否Rohs认证： 不符合生命周期：Obsolete
零件包装代码：CSP包装说明：R-PBGA-B10
针数：10Reach Compliance Code：unknown
ECCN代码：EAR99HTS代码：8541.10.00.50
风险等级：5.92配置：COMMON BIPOLAR TERMINAL, 8 ELEMENTS
二极管元件材料：SILICON二极管类型：TRANS VOLTAGE SUPPRESSOR DIODE
JESD-30 代码：R-PBGA-B10JESD-609代码：e0
元件数量：8端子数量：10
封装主体材料：PLASTIC/EPOXY封装形状：RECTANGULAR
封装形式：GRID ARRAY峰值回流温度（摄氏度）：220
极性：BIDIRECTIONAL认证状态：Not Qualified
表面贴装：YES技术：AVALANCHE
端子面层：TIN LEAD端子形式：BALL
端子位置：BOTTOM处于峰值回流温度下的最长时间：NOT SPECIFIED
Base Number Matches：1

PACDN2408C 数据手册

 浏览型号PACDN2408C的Datasheet PDF文件第2页浏览型号PACDN2408C的Datasheet PDF文件第3页 
PACDN1408C  
PACDN2408C  
CALIFORNIA MICRO DEVICES  
ESD PROTECTION ARRAY, 8 CHANNEL, CHIP SCALE PACKAGE  
Features  
Applications  
• 8 transient voltage suppressors in a single chip  
scale wafer level package.  
• ESD protection of cellular phones, PDA, internet  
appliances and PC ports.  
• Compact Chip Scale Package (CSP) format  
saves board space and ease layout in space  
critical applications compared to discrete  
solutions and traditional wire bonded packages.  
• Protection of interface ports or IC pins which are  
exposed to high levels of ESD.  
• PACDN2408C can be used for ESD protection of  
set-top box R,L,V ports.  
• In-system Electro Static Discharge (ESD)  
protection to 20kV contact discharge per  
IEC 61000-4-2 international standard.  
• PACDN2408C features back-to-back zener  
protection for AC signals.  
Product Description  
The PACDN1408C and PACDN2408C are transient  
voltage suppressor arrays that provide a very high  
level of protection for sensitive electronic components  
that may be subjected to ESD. The back-to-back zener  
connections of the PACDN2408C provides ESD  
protection in cases where nodes with AC signals are  
present.  
charge). All I/Os are rated at 20kV using the IEC  
61000-4-2 contact discharge method. Using the MIL-  
STD-883D (Method 3015) specification for Human  
Body Model (HBM) ESD, all pins are protected for  
contact discharges to greater than 30kV.  
The Chip Scale Package format of these devices  
enable extremely small footprints that are necessary in  
portable electronics such as cellular phones, PDAs,  
internet appliances and PCs. The large solder bumps  
allow for standard attachment to laminate boards  
without the use of underfill.  
These devices are designed and characterized to  
safely dissipate ESD strikes at levels well beyond the  
maximum requirements set forth in the IEC 61000-4-2  
international standard (Level 4, 8kV contact dis-  
SCHEMATIC DIAGRAMS  
B1 B2 B3 B4 B5  
B1 B2 B3 B4 B5  
A1 A2 A3 A4 A5  
PACDN1408C  
A1 A2 A3 A4 A5  
PACDN2408C  
STANDARD PART ORDERING INFORMATION  
Package Ordering Part Number  
Style  
Bumps  
10  
Tape & Reel  
PACDN1408C/R  
PACDN2408C/R  
Part Marking  
Chip Scale  
Chip Scale  
10  
© 2000 California Micro Devices Corp. All rights reserved.  
C1130600  
6/19/2000  
215 Topaz Street, Milpitas, California 95035  
Tel: (408) 263-3214  
Fax: (408) 263-7846  
www.calmicro.com  
1
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PACDN2416C/R CALMIRCO

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PACDN3401C CALMIRCO

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 		TRANSIENT VOLTAGE SUPPRESSOR, SINGLE 5V, 0402 SMD
PACDN3401C/R CALMIRCO

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PACDN3401R CALMIRCO

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 		Trans Voltage Suppressor Diode, 5.8V V(RWM), Bidirectional,

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