5秒后页面跳转
ORSPI4-3FTE1036C PDF预览

ORSPI4-3FTE1036C

更新时间: 2024-09-16 03:43:27
品牌 Logo 应用领域
莱迪思 - LATTICE /
页数 文件大小 规格书
263页 1195K
描述
Dual SPI4 Interface and High-Speed SERDES FPSC

ORSPI4-3FTE1036C 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
零件包装代码:BGA包装说明:45 X 45 MM, FTSBGA-1036
针数:1036Reach Compliance Code:not_compliant
ECCN代码:EAR99HTS代码:8542.39.00.01
风险等级:5.9最大时钟频率:185 MHz
JESD-30 代码:S-PBGA-B1036长度:45 mm
湿度敏感等级:1可配置逻辑块数量:2024
等效关口数量:471000端子数量:1036
最高工作温度:125 °C最低工作温度:-40 °C
组织:2024 CLBS, 471000 GATES封装主体材料:PLASTIC/EPOXY
封装代码:BGA封装形状:SQUARE
封装形式:GRID ARRAY峰值回流温度(摄氏度):225
可编程逻辑类型:FIELD PROGRAMMABLE GATE ARRAY认证状态:Not Qualified
座面最大高度:1.8 mm最大供电电压:3.6 V
最小供电电压:3 V标称供电电压:3.3 V
表面贴装:YES温度等级:AUTOMOTIVE
端子形式:BALL端子节距:1 mm
端子位置:BOTTOM处于峰值回流温度下的最长时间:NOT SPECIFIED
宽度:45 mmBase Number Matches:1

ORSPI4-3FTE1036C 数据手册

 浏览型号ORSPI4-3FTE1036C的Datasheet PDF文件第2页浏览型号ORSPI4-3FTE1036C的Datasheet PDF文件第3页浏览型号ORSPI4-3FTE1036C的Datasheet PDF文件第4页浏览型号ORSPI4-3FTE1036C的Datasheet PDF文件第5页浏览型号ORSPI4-3FTE1036C的Datasheet PDF文件第6页浏览型号ORSPI4-3FTE1036C的Datasheet PDF文件第7页 
ORCA® ORSPI4  
Dual SPI4 Interface  
and High-Speed SERDES FPSC  
October 2007  
Data Sheet  
Lattice Semiconductor has developed a next-generation FPSC targeted at high-speed data transmission. Built on  
the Series 4 reconfigurable embedded System-on-a-Chip (SoC) architecture, the ORSPI4 FPSC contains two  
SPI4.2 interface blocks, a high-speed Memory Controller, four channels of 0.6-3.7 Gbits/s SERDES with 8b/10b  
encoding and decoding and over 600K programmable system gates all on a single chip.  
Simple FIFO interface to the FPGA logic  
Embedded SPI4 Core Features  
• Provides ease of design and efficient clock  
OIF-SPI4-02.0 compliant interfaces  
domain transfers  
Dynamic timing receive interface:  
Loopback modes provided for system- and  
chip-level debug  
• Full bandwidth up to 450 MHz DDR (900  
Mbits/s) for all speed grades.  
Embedded 32-bit internal system bus plus 4-bit  
parity  
• Interconnects FPGA logic, microprocessor inter-  
face (MPI), embedded RAM blocks, and embed-  
ded core blocks  
• Includes built-in system registers that act as the  
control and status center for the device  
• Bit de-skewing up to 16 phases of the clock  
• Capable of aligning bit-to-bit skews as large as  
1 bit periods  
Static timing receive interface:  
• Speeds up to 325 MHz DDR (650 Mbits/s), for  
all speed grades, including Quarter-Rate mode  
• Clock aligned or clock centered modes sup-  
ported  
Low power operation.  
• Full-rate SPI4.2 interfaces running at 450 MHz  
DDR (900 Mbits/sec) with dynamic alignment  
consumes 1.5 W of power or less. More efficient  
than FPGAs with soft-IP SPI4 solutions which  
consume in excess of 10 W.  
DIP-4 and DIP-2 parity generation and checking  
Transmit Interface:  
• Speeds up to 450 MHz DDR (900 Mbits/s)  
• Dedicated LVDS transmit interface for improved  
data eye integrity  
• Automatic idle insertion  
Programmable Minburst capability with  
selectable burst values ranging from 16 to 240.  
Interoperability demonstrated with ORSPI4  
partners.  
256 logical ports:  
• Embedded Calendar-based sequence port poll-  
ing mechanism and bandwidth allocation.  
Shadow Calendar support for smooth transition  
to new Calendar  
Embedded SERDES Core Features  
Quad 600 Mbits/s to 3.7 Gbits/s SERDES:  
• IEEE 802.3ae XAUI (Link State Machine &  
• Up to 32 independent TX and 32 independent  
RX buffers per SPI4 interface internally. Various  
aggregation modes to support 1 to 32 separate  
embedded buffers per TX and RX  
• Up to 4 independent TX and 4 independent RX  
clock domain transfers to the FPGA logic  
Alignment FIFOs embedded)  
• ANSI X3.230:1994 1G/2G FC-compliant (Link  
State Machine & Alignment FIFOs embedded)  
• Proven performance (same SERDES used in  
ORT82G5/ORT42G5 FPSCs)  
Embedded Memory Controller Features  
FIFO status support modes:  
• 1/4 rate LVTTL or 1/4 rate LVDS  
• Automatic status handling or optionally under  
user control. Credit calculations based on burst  
size and status are also handled automatically  
High Performance Memory Controller for  
interface to external buffer memory  
• Required for Layer 2 data buffering  
• QDR II memory interface:  
– 36-bit Input and 36-bit Output bus, 18-bit address  
– 175 MHz clock rates  
Configuration options as suggested in the OIF-  
SPI4-02.0 standard  
• Configures parameters such as maximum burst  
– 20+ Gbits/s bandwidth  
– Supports 2- or 4-word burst mode  
– Simple FIFO interface to FPGA  
– Integrated PLL for optimized performance  
– Proven performance with multiple memory suppliers  
size, calendar length, main and shadow calen-  
dars (1K deep each), length of training  
sequence etc.  
Note: The term SPI4 refers to OIF SPI-4.2 throughout this document  
© 2007 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand  
or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.  
www.latticesemi.com  
1
ORSPI4_06  

与ORSPI4-3FTE1036C相关器件

型号 品牌 获取价格 描述 数据表
ORT2200 BOT

获取价格

1.8mm LED 2 TIER CIRCUIT BOARD INDICATOR
ORT2200B BOT

获取价格

1.8mm LED 2 TIER CIRCUIT BOARD INDICATOR
ORT2200BL BOT

获取价格

1.8mm LED 2 TIER CIRCUIT BOARD INDICATOR
ORT2200G BOT

获取价格

1.8mm LED 2 TIER CIRCUIT BOARD INDICATOR
ORT2200O BOT

获取价格

1.8mm LED 2 TIER CIRCUIT BOARD INDICATOR
ORT2200R BOT

获取价格

1.8mm LED 2 TIER CIRCUIT BOARD INDICATOR
ORT2200Y BOT

获取价格

1.8mm LED 2 TIER CIRCUIT BOARD INDICATOR
ORT2400 BOT

获取价格

4 ELEMENT PCB MOUNT 1.8mm LED ARRAY
ORT2400B BOT

获取价格

4 ELEMENT PCB MOUNT 1.8mm LED ARRAY
ORT2400BL BOT

获取价格

4 ELEMENT PCB MOUNT 1.8mm LED ARRAY