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OPA2340TDF2 PDF预览

OPA2340TDF2

更新时间： 2024-09-16 12:11:15
品牌 Logo 应用领域
德州仪器 - TI 运算放大器
页数 文件大小 规格书
5页 80K
描述
SINGLE-SUPPLY, RAIL-TO-RAIL OPERATIONAL AMPLIFIER MicroAmplifier

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OPA2340TDF2 技术参数

是否无铅： 不含铅是否Rohs认证： 符合
生命周期：Active包装说明：DIE,
Reach Compliance Code：not_compliantECCN代码：EAR99
HTS代码：8542.33.00.01Factory Lead Time：16 weeks
风险等级：5.45放大器类型：OPERATIONAL AMPLIFIER
最大平均偏置电流 (IIB)：0.00001 µA最小共模抑制比：80 dB
标称共模抑制比：92 dB最大输入失调电压：500 µV
JESD-30 代码：R-XUUC-N10长度：1.4436 mm
功能数量：2端子数量：10
封装主体材料：UNSPECIFIED封装代码：DIE
封装形状：RECTANGULAR封装形式：UNCASED CHIP
包装方法：TUBE峰值回流温度（摄氏度）：NOT SPECIFIED
标称压摆率：6 V/us子类别：Operational Amplifier
最大压摆率：1.9 mA表面贴装：YES
技术：CMOS端子形式：NO LEAD
端子位置：UPPER处于峰值回流温度下的最长时间：NOT SPECIFIED
标称均一增益带宽：5500 kHz宽度：1.4337 mm

OPA2340TDF2 数据手册

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OPA2340-DIE  
www.ti.com  
SBOS691A –JUNE 2013–REVISED SEPTEMBER 2013  
SINGLE-SUPPLY, RAIL-TO-RAIL OPERATIONAL AMPLIFIER  
MicroAmplifier ™  
Check for Samples: OPA2340-DIE  
1
FEATURES  
23  
•
Rail-to-Rail Input  
APPLICATIONS  
•
Rail-to-Rail Output  
Wide Bandwidth  
•
•
•
•
•
•
•
•
Driving A/D Converters  
PCMCIA Cards  
•
•
•
•
•
High Slew Rate  
Data Acquisition  
Process Control  
Audio Processing  
Communications  
Active Filters  
Low THD+Noise  
Low Quiescent Current  
Single, Dual, and Quad Versions  
Test Equipment  
DESCRIPTION  
The OPA2340-DIE rail-to-rail CMOS operational amplifier is optimized for low-voltage, single-supply operation.  
Rail-to-rail input/output and high-speed operation make them ideal for driving sampling analog-to-digital (A/D)  
converters. The OPA2340-DIE is also well-suited for general purpose and audio applications as well as providing  
I/V conversion at the output of digital-to-analog (D/A) converters. Single, dual, and quad versions have identical  
specifications for design flexibility.  
The OPA2340-DIE operates on a single supply. Dual and quad designs feature completely independent circuitry  
for lowest crosstalk and freedom from interaction.  
ORDERING INFORMATION(1)  
PACKAGE  
DESIGNATOR  
PRODUCT  
PACKAGE  
ORDERABLE PART NUMBER  
PACKAGE QUANTITY  
OPA2340TDF1  
OPA2340TDF2  
100  
10  
OPA2340  
TD  
Bare die in waffle pack(2)  
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI  
web site at www.ti.com.  
(2) Processing is per the Texas Instruments commercial production baseline and is in compliance with the Texas Instruments Quality  
Control System in effect at the time of manufacture. Electrical screening consists of DC parametric and functional testing at room  
temperature only. Unless otherwise specified by Texas Instruments AC performance and performance over temperature is not  
warranted. Visual Inspection is performed in accordance with MIL-STD-883 Test Method 2010 Condition B at 75X minimum.  
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
2
3
MicroAmplifier is a trademark of Texas Instruments, Inc.  
All other trademarks are the property of their respective owners.  
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
Copyright © 2013, Texas Instruments Incorporated  
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