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NVTFS4824NTWG PDF预览

NVTFS4824NTWG

更新时间: 2024-11-05 12:19:15
品牌 Logo 应用领域
安森美 - ONSEMI /
页数 文件大小 规格书
6页 122K
描述
30 V, 4.7 m, 46 A, Single N−Channel

NVTFS4824NTWG 数据手册

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NVTFS4824N  
Power MOSFET  
30 V, 4.7 mW, 46 A, Single NChannel  
Features  
Small Footprint (3.3 x 3.3 mm) for Compact Design  
Low R  
to Minimize Conduction Losses  
DS(on)  
http://onsemi.com  
Low Capacitance to Minimize Driver Losses  
NVTFS4824NWF Wettable Flanks Product  
AECQ101 Qualified and PPAP Capable  
V
R
MAX  
I MAX  
D
(BR)DSS  
DS(on)  
4.7 mW @ 10 V  
7.5 mW @ 4.5 V  
These Devices are PbFree and are RoHS Compliant  
30 V  
46 A  
MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
J
Parameter  
DraintoSource Voltage  
Symbol  
Value  
30  
Unit  
V
NChannel  
D (5 8)  
V
DSS  
GatetoSource Voltage  
V
"20  
46  
V
GS  
Continuous Drain Cur-  
T
= 25°C  
I
A
mb  
D
rent R  
(Notes 1,  
Y
Jmb  
T
mb  
= 100°C  
33  
2, 3, 4)  
G (4)  
Steady  
State  
Power Dissipation  
T
mb  
= 25°C  
P
21  
11  
W
A
D
R
(Notes 1, 2, 3)  
Y
Jmb  
S (1, 2, 3)  
T
mb  
= 100°C  
Continuous Drain Cur-  
T = 25°C  
I
18.2  
A
D
MARKING DIAGRAM  
rent R  
& 4)  
(Notes 1, 3,  
q
JA  
T = 100°C  
A
12.8  
Steady  
State  
1
1
S
S
S
G
D
D
D
D
Power Dissipation  
(Notes 1, 3)  
T = 25°C  
P
3.2  
1.6  
402  
W
A
D
XXXX  
AYWWG  
G
R
WDFN8  
(m8FL)  
CASE 511AB  
q
JA  
T = 100°C  
A
Pulsed Drain Current  
T = 25°C, t = 10 ms  
I
DM  
A
A
p
Operating Junction and Storage Temperature  
T , T  
55 to  
175  
°C  
J
stg  
XXXX = Specific Device Code  
A
Y
WW  
G
= Assembly Location  
= Year  
= Work Week  
Source Current (Body Diode)  
I
21  
72  
A
S
Single Pulse DraintoSource Avalanche  
E
AS  
mJ  
Energy (T = 25°C, V = 50 V, V = 10 V,  
J
DD  
GS  
= PbFree Package  
I
= 38 A, L = 0.1 mH, R = 25 W)  
L(pk)  
G
(Note: Microdot may be in either location)  
Lead Temperature for Soldering Purposes  
(1/8from case for 10 s)  
T
260  
°C  
L
Stresses exceeding Maximum Ratings may damage the device. Maximum  
Ratings are stress ratings only. Functional operation above the Recommended  
Operating Conditions is not implied. Extended exposure to stresses above the  
Recommended Operating Conditions may affect device reliability.  
ORDERING INFORMATION  
See detailed ordering, marking and shipping information in the  
package dimensions section on page 5 of this data sheet.  
THERMAL RESISTANCE MAXIMUM RATINGS (Note 1)  
Parameter  
Symbol  
Value  
Unit  
JunctiontoMounting Board (top) Steady  
State (Notes 2 and 3)  
R
7.2  
°C/W  
Y
Jmb  
JunctiontoAmbient Steady State (Note 3)  
R
47  
q
JA  
1. The entire application environment impacts the thermal resistance values shown,  
they are not constants and are only valid for the particular conditions noted.  
2. Psi (Y) is used as required per JESD5112 for packages in which  
substantially less than 100% of the heat flows to single case surface.  
2
3. Surfacemounted on FR4 board using a 650 mm , 2 oz. Cu pad.  
4. Maximum current for pulses as long as 1 second is higher but is dependent  
on pulse duration and duty cycle.  
© Semiconductor Components Industries, LLC, 2013  
1
Publication Order Number:  
May, 2013 Rev. 2  
NVTFS4824N/D  
 

NVTFS4824NTWG 替代型号

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