5秒后页面跳转
NVMFS5C430NL_17 PDF预览

NVMFS5C430NL_17

更新时间: 2024-01-26 05:55:33
品牌 Logo 应用领域
安森美 - ONSEMI /
页数 文件大小 规格书
6页 125K
描述
Power MOSFET

NVMFS5C430NL_17 数据手册

 浏览型号NVMFS5C430NL_17的Datasheet PDF文件第2页浏览型号NVMFS5C430NL_17的Datasheet PDF文件第3页浏览型号NVMFS5C430NL_17的Datasheet PDF文件第4页浏览型号NVMFS5C430NL_17的Datasheet PDF文件第5页浏览型号NVMFS5C430NL_17的Datasheet PDF文件第6页 
NVMFS5C430NL  
Power MOSFET  
40 V, 1.4 mW, 200 A, Single NChannel  
Features  
Small Footprint (5x6 mm) for Compact Design  
Low R  
to Minimize Conduction Losses  
Low Q and Capacitance to Minimize Driver Losses  
DS(on)  
www.onsemi.com  
G
NVMFS5C430NLWF Wettable Flank Option for Enhanced Optical  
Inspection  
V
R
MAX  
I MAX  
D
(BR)DSS  
DS(ON)  
AECQ101 Qualified and PPAP Capable  
These Devices are PbFree and are RoHS Compliant  
1.4 mW @ 10 V  
2.2 mW @ 4.5 V  
40 V  
200 A  
MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
J
Parameter  
DraintoSource Voltage  
Symbol  
Value  
40  
Unit  
V
D (5,6)  
V
DSS  
GatetoSource Voltage  
V
GS  
20  
V
Continuous Drain  
Current R  
T
= 25°C  
I
200  
A
C
D
G (4)  
q
JC  
T
C
= 100°C  
140  
(Notes 1, 3)  
Steady  
State  
Power Dissipation  
T
C
= 25°C  
P
110  
53  
W
A
D
S (1,2,3)  
NCHANNEL MOSFET  
R
(Note 1)  
q
JC  
T
C
= 100°C  
Continuous Drain  
Current R  
T = 25°C  
A
I
D
38  
q
JA  
T = 100°C  
A
27  
(Notes 1, 2, 3)  
Steady  
State  
MARKING  
DIAGRAM  
Power Dissipation  
T = 25°C  
A
P
3.8  
1.9  
900  
W
D
R
(Notes 1 & 2)  
q
JA  
T = 100°C  
A
D
1
S
S
S
G
D
D
Pulsed Drain Current  
T = 25°C, t = 10 ms  
I
DM  
A
A
p
DFN5  
(SO8FL)  
CASE 488AA  
STYLE 1  
XXXXXX  
AYWZZ  
Operating Junction and Storage Temperature  
T , T  
55 to  
°C  
J
stg  
+ 175  
Source Current (Body Diode)  
I
S
120  
493  
A
D
Single Pulse DraintoSource Avalanche  
E
AS  
mJ  
XXXXXX = 5C430L  
XXXXXX = (NVMFS5C430NL) or  
XXXXXX = 430LWF  
Energy (I  
= 15 A)  
L(pk)  
Single Pulse DraintoSource Voltage  
(t = 10 ms)  
p
V
DSM  
48  
V
XXXXXX = (NVMFS5C430NLWF)  
A
Y
W
ZZ  
= Assembly Location  
= Year  
= Work Week  
= Lot Traceability  
Lead Temperature for Soldering Purposes  
(1/8from case for 10 s)  
T
L
260  
°C  
Stresses exceeding those listed in the Maximum Ratings table may damage the  
device. If any of these limits are exceeded, device functionality should not be  
assumed, damage may occur and reliability may be affected.  
THERMAL RESISTANCE MAXIMUM RATINGS  
ORDERING INFORMATION  
See detailed ordering, marking and shipping information on  
page 5 of this data sheet.  
Parameter  
Symbol  
Value  
Unit  
JunctiontoCase Steady State  
R
1.4  
40  
°C/W  
q
JC  
JunctiontoAmbient Steady State (Note 2)  
R
q
JA  
1. The entire application environment impacts the thermal resistance values shown,  
they are not constants and are only valid for the particular conditions noted.  
2
2. Surfacemounted on FR4 board using a 650 mm , 2 oz. Cu pad.  
3. Maximum current for pulses as long as 1 second is higher but is dependent  
on pulse duration and duty cycle.  
© Semiconductor Components Industries, LLC, 2016  
1
Publication Order Number:  
February, 2017 Rev. 3  
NVMFS5C430NL/D