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NVD5890NT4G PDF预览

NVD5890NT4G

更新时间: 2024-11-09 12:36:43
品牌 Logo 应用领域
安森美 - ONSEMI /
页数 文件大小 规格书
7页 116K
描述
Power MOSFET 40 V, 123 A, Single N−Channel DPAK

NVD5890NT4G 技术参数

是否无铅: 不含铅生命周期:Lifetime Buy
包装说明:SMALL OUTLINE, R-PSSO-G2针数:3
Reach Compliance Code:not_compliantECCN代码:EAR99
风险等级:5.18雪崩能效等级(Eas):240 mJ
外壳连接:DRAIN配置:SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压:40 V最大漏极电流 (Abs) (ID):123 A
最大漏极电流 (ID):24 A最大漏源导通电阻:0.0037 Ω
FET 技术:METAL-OXIDE SEMICONDUCTORJESD-30 代码:R-PSSO-G2
JESD-609代码:e3湿度敏感等级:1
元件数量:1端子数量:2
工作模式:ENHANCEMENT MODE最高工作温度:175 °C
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:SMALL OUTLINE峰值回流温度(摄氏度):NOT SPECIFIED
极性/信道类型:N-CHANNEL最大功率耗散 (Abs):107 W
最大脉冲漏极电流 (IDM):400 A认证状态:Not Qualified
子类别:FET General Purpose Power表面贴装:YES
端子面层:Tin (Sn)端子形式:GULL WING
端子位置:SINGLE处于峰值回流温度下的最长时间:NOT SPECIFIED
晶体管应用:SWITCHING晶体管元件材料:SILICON
Base Number Matches:1

NVD5890NT4G 数据手册

 浏览型号NVD5890NT4G的Datasheet PDF文件第2页浏览型号NVD5890NT4G的Datasheet PDF文件第3页浏览型号NVD5890NT4G的Datasheet PDF文件第4页浏览型号NVD5890NT4G的Datasheet PDF文件第5页浏览型号NVD5890NT4G的Datasheet PDF文件第6页浏览型号NVD5890NT4G的Datasheet PDF文件第7页 
NVD5890N  
Power MOSFET  
40 V, 123 A, Single NChannel DPAK  
Features  
Low R  
to Minimize Conduction Losses  
MSL 1/260°C  
DS(on)  
http://onsemi.com  
AEC Q101 Qualified and PPAP Capable  
100% Avalanche Tested  
These Devices are PbFree, Halogen Free/BFR Free and are RoHS  
Compliant  
V
R
I
D
(BR)DSS  
DS(on)  
40 V  
3.7 mW @ 10 V  
123 A  
Applications  
Motor Drivers  
D
Pump Drivers for Automotive Braking, Steering and Other High  
Current Systems  
NChannel  
MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
J
G
Parameter  
DraintoSource Voltage  
Symbol  
Value  
40  
Unit  
V
V
DSS  
S
GatetoSource Voltage  
V
"20  
123  
95  
V
GS  
4
Continuous Drain Cur-  
T
T
T
= 25°C  
= 85°C  
= 25°C  
I
A
C
C
C
D
rent (R  
)
q
JC  
2
1
Power Dissipation  
(R  
P
107  
W
A
D
3
)
q
JC  
Steady  
State  
CASE 369C  
DPAK  
(Bent Lead)  
STYLE 2  
Continuous Drain Cur-  
rent (R ) (Note 1)  
T = 25°C  
A
I
24  
18.5  
4.0  
D
q
JA  
T = 85°C  
A
Power Dissipation  
(R ) (Note 1)  
T = 25°C  
A
P
W
D
q
JA  
MARKING DIAGRAMS  
& PIN ASSIGNMENT  
Pulsed Drain Current  
t =10ms T = 25°C  
I
400  
100  
A
A
p
A
DM  
I
DmaxPkg  
Current Limited by Package  
T = 25°C  
A
4
Operating Junction and Storage Temperature  
T , T  
J
55 to  
175  
°C  
stg  
Drain  
Source Current (Body Diode)  
Drain to Source dV/dt  
I
100  
6.0  
A
S
dV/dt  
V/ns  
mJ  
Single Pulse DraintoSource Avalanche En-  
E
AS  
240  
2
ergy (V = 32 V, V = 10 V,  
DD  
GS  
Drain  
L = 0.3 mH, I  
= 40 A, R = 25 W)  
1
3
L(pk)  
G
Gate Source  
Lead Temperature for Soldering Purposes  
(1/8from case for 10 s)  
T
L
260  
°C  
Y
WW  
= Year  
= Work Week  
Stresses exceeding Maximum Ratings may damage the device. Maximum  
Ratings are stress ratings only. Functional operation above the Recommended  
Operating Conditions is not implied. Extended exposure to stresses above the  
Recommended Operating Conditions may affect device reliability.  
5890N = Device Code  
= PbFree Package  
G
ORDERING INFORMATION  
See detailed ordering and shipping information in the package  
dimensions section on page 6 of this data sheet.  
© Semiconductor Components Industries, LLC, 2012  
1
Publication Order Number:  
January, 2012 Rev. 1  
NVD5890N/D  

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