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NTS4173P PDF预览

NTS4173P

更新时间: 2024-11-20 06:00:39
品牌 Logo 应用领域
安森美 - ONSEMI /
页数 文件大小 规格书
6页 109K
描述
Power MOSFET −30 V, −1.3 A, Single P−Channel, SC−70

NTS4173P 数据手册

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NTS4173P  
Power MOSFET  
30 V, 1.3 A, Single PChannel, SC70  
Features  
30 V BV , Low R  
in SC70 Package  
ds  
DS(on)  
Low Threshold Voltage  
Fast Switching Speed  
http://onsemi.com  
This is a HalideFree Device  
This is a PbFree Device  
V
R
MAX  
I MAX  
D
(BR)DSS  
DS(on)  
150 mW @ 10 V  
200 mW @ 4.5 V  
280 mW @ 2.5 V  
1.2 A  
1.0 A  
0.9 A  
Applications  
Load Switch  
Low Current Inverter and DCDC Converters  
Power Switch for Printers, Communication Equipment  
30 V  
SC70/SOT323 (3 LEADS)  
S
MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
J
Parameter  
DraintoSource Voltage  
Symbol Value  
Unit  
V
V
DSS  
30  
12  
GatetoSource Voltage  
V
GS  
V
G
Continuous Drain  
Current (Note 1)  
T = 25°C  
1.2  
0.80  
1.3  
0.29  
A
Steady  
State  
T = 85°C  
A
I
A
D
D
t 5 s  
T = 25°C  
A
MARKING DIAGRAM/  
PIN ASSIGNMENT  
Power Dissipation  
(Note 1)  
Steady  
State  
3
T = 25°C  
A
P
W
D
1
t 5 s  
0.35  
3 Drain  
2
Pulsed Drain Current  
t = 10 ms  
I
5.0  
A
TGMG  
p
DM  
SC70/SOT323  
CASE 419  
G
Operating Junction and Storage Temperature  
T ,  
T
55 to  
150  
J
°C  
1
Gate  
2
stg  
STYLE 8  
Source  
Source Current (Body Diode)  
I
S
1.0  
A
TG  
M
G
= Specific Device Code  
= Date Code*  
= PbFree Package  
Lead Temperature for Soldering Purposes  
T
260  
°C  
L
(1/8from case for 10 s)  
Stresses exceeding Maximum Ratings may damage the device. Maximum  
Ratings are stress ratings only. Functional operation above the Recommended  
Operating Conditions is not implied. Extended exposure to stresses above the  
Recommended Operating Conditions may affect device reliability.  
(Note: Microdot may be in either location)  
ORDERING INFORMATION  
THERMAL RESISTANCE RATINGS  
Device  
Package  
Shipping  
Parameter  
Symbol  
Max  
425  
360  
Unit  
NTS4173PT1G  
SC70  
(PbFree)  
3000/Tape & Reel  
JunctiontoAmbient Steady State (Note 1)  
JunctiontoAmbient t 5 s (Note 1)  
R
°C/W  
q
JA  
R
q
JA  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specification  
Brochure, BRD8011/D.  
1. Surfacemounted on FR4 board using 1 in sq pad size (Cu area = 1.127 in sq  
[2 oz] including traces)  
* Date code orientation may vary depending upon  
manufacturing location  
© Semiconductor Components Industries, LLC, 2008  
1
Publication Order Number:  
September, 2008 Rev. 0  
NTS4173P/D  
 

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