NTS4173PT1G

更新时间： 2024-11-24 06:00:39

品牌	Logo	应用领域
安森美 - ONSEMI		/
页数	文件大小	规格书
6页	109K
描述
Power MOSFET −30 V, −1.3 A, Single P−Channel, SC−70

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中文翻译

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NTS4173PT1G 数据手册

NTS4173P

Power MOSFET

−30 V, −1.3 A, Single P−Channel, SC−70

Features

• −30 V BV , Low R

in SC−70 Package

DS(on)

• Low Threshold Voltage

• Fast Switching Speed

http://onsemi.com

• This is a Halide−Free Device

• This is a Pb−Free Device

MAX

I MAX

(BR)DSS

DS(on)

150 mW @ −10 V

200 mW @ −4.5 V

280 mW @ −2.5 V

−1.2 A

−1.0 A

−0.9 A

Applications

• Load Switch

• Low Current Inverter and DC−DC Converters

• Power Switch for Printers, Communication Equipment

−30 V

SC−70/SOT−323 (3 LEADS)

MAXIMUM RATINGS (T = 25°C unless otherwise noted)

Parameter

Drain−to−Source Voltage

Symbol Value

Unit

DSS

−30

Gate−to−Source Voltage

Continuous Drain

Current (Note 1)

T = 25°C

−1.2

−0.80

−1.3

0.29

Steady

State

T = 85°C

t ≤ 5 s

T = 25°C

MARKING DIAGRAM/

PIN ASSIGNMENT

Power Dissipation

(Note 1)

Steady

State

T = 25°C

t ≤ 5 s

0.35

3 Drain

Pulsed Drain Current

t = 10 ms

−5.0

TGMG

SC−70/SOT−323

CASE 419

Operating Junction and Storage Temperature

T ,

−55 to

150

°C

Gate

stg

STYLE 8

Source

Source Current (Body Diode)

−1.0

= Specific Device Code

= Date Code*

= Pb−Free Package

Lead Temperature for Soldering Purposes

260

°C

(1/8″ from case for 10 s)

Stresses exceeding Maximum Ratings may damage the device. Maximum

Ratings are stress ratings only. Functional operation above the Recommended

Operating Conditions is not implied. Extended exposure to stresses above the

Recommended Operating Conditions may affect device reliability.

(Note: Microdot may be in either location)

ORDERING INFORMATION

THERMAL RESISTANCE RATINGS

†

Device

Package

Shipping

Parameter

Symbol

Max

425

360

Unit

NTS4173PT1G

SC−70

(Pb−Free)

3000/Tape & Reel

Junction−to−Ambient − Steady State (Note 1)

Junction−to−Ambient − t ≤ 5 s (Note 1)

°C/W

†For information on tape and reel specifications,

including part orientation and tape sizes, please

refer to our Tape and Reel Packaging Specification

Brochure, BRD8011/D.

1. Surface−mounted on FR4 board using 1 in sq pad size (Cu area = 1.127 in sq

[2 oz] including traces)

* Date code orientation may vary depending upon

manufacturing location

Publication Order Number:

September, 2008 − Rev. 0

NTS4173P/D

12 3 4 5 6

中文翻译

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