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NTL06G27NTRF PDF预览

NTL06G27NTRF

更新时间: 2024-11-30 20:38:07
品牌 Logo 应用领域
尼吉康 - NICHICON 大电流电感器测试
页数 文件大小 规格书
4页 165K
描述
General Purpose Inductor, 0.027uH, 2%, 1 Element, Alumina-Core, SMD, 0603, CHIP, 0603, ROHS COMPLIANT

NTL06G27NTRF 技术参数

是否Rohs认证: 符合生命周期:Obsolete
包装说明:0603Reach Compliance Code:compliant
ECCN代码:EAR99HTS代码:8504.50.80.00
风险等级:5.84大小写代码:0603
构造:Chip型芯材料:ALUMINA
直流电阻:2 Ω标称电感 (L):0.027 µH
电感器应用:HIGH CURRENT INDUCTOR电感器类型:GENERAL PURPOSE INDUCTOR
JESD-609代码:e3功能数量:1
端子数量:2最高工作温度:125 °C
最低工作温度:-40 °C封装高度:0.45 mm
封装长度:1.6 mm封装形式:SMT
封装宽度:0.8 mm包装方法:TR
最小质量因数(标称电感时):15最大额定电流:0.2 A
自谐振频率:2000 MHz形状/尺寸说明:RECTANGULAR PACKAGE
屏蔽:NO特殊特征:Q MEASURED AT 300 MHZ
表面贴装:YES端子面层:Tin (Sn) - with Nickel (Ni) barrier
端子位置:DUAL ENDED端子形状:WRAPAROUND
测试频率:300 MHz容差:2%
Base Number Matches:1

NTL06G27NTRF 数据手册

 浏览型号NTL06G27NTRF的Datasheet PDF文件第2页浏览型号NTL06G27NTRF的Datasheet PDF文件第3页浏览型号NTL06G27NTRF的Datasheet PDF文件第4页 
NTL Series  
Thin Film Chip Inductors  
FEATURES  
• ULTRA-SMALL LOW PROFILE 0201, 0402 & 0603SIZES  
• HIGH Q (15 ~ 40) @ 300MHz ~ 1.5GHz  
• S-PARAMETER CHARACTERISTICS AVAILABLE  
• HIGH CURRENT & HIGH SRF  
RoHS  
Compliant  
includes all homogeneous materials  
• COMPATIBLE WITH Pb-FREE SOLDERING  
• RoHS COMPLIANT  
*See Part Number System for Details  
CHARACTERISTICS  
0201  
0402  
0603*  
Case Size  
1.0nH ~ 5.6nH  
1.0nH ~ 15nH  
1.0nH ~ 100nH  
Inductance Range  
Available Tolerance  
Temperature Range  
Resistance to Solder Heat  
Temperature Cycling  
±0.1nH (B), ±0.2nH (C) & 2% (G)  
-40°C ~ +125°C  
±0.2nH (C) & 2% (G)  
270°C ±5°C for 10 seconds  
ΔL±10% after 10 cycles -40°C/+20°C/+85°C/+20°C  
*Not recommended for new designs (see NTI06 series)  
CONSTRUCTION  
PART NUMBER SYSTEM  
NTL 02 C 33N TR F  
RoHS compliant  
Tape & Reel Packaging  
Inductance Value in nano-henries,  
"N" indicates decimal point  
Inductance Tolerance (see values tables)  
Case Code  
Copper (Cu)  
Termination Base  
Series  
2µm Nickel (Ni) Barrier  
3µm Tin (Sn) Outerplating  
CASE DIMENSIONS (mm)  
Case Sixe  
0201  
L
W
T
P
Alumina Substrate  
Etched Copper Coil  
0.61 ± 0.05 0.31 ± 0.05 0.28 ± 0.05 0.12 ± 0.05  
0402  
1.0 ± 0.10  
1.6 ± 0.10  
0.5 ± 0.10 0.40 ± 0.10 0.25 ± 0.10  
0.8 ± 0.10 0.45 ± 0.10 0.30 ± 0.10  
T
0603  
LAND PATTERN DIMENSIONS (mm)  
W
P
Case Sixe  
0201  
A
B
C
D
0.2 ~ 0.3  
0.5 ~ 0.6  
0.6 ~ 1.0  
0.8 ~ 0.9  
1.5 ~ 1.8  
2.4 ~ 2.8  
0.2 ~ 0.3  
0.5 ~ 0.6  
0.7 ~ 0.9  
0.3 ~ 0.4  
0.5 ~ 0.6  
0.9 ~ 1.1  
L
0402  
0603  
REFLOW SOLDERING PROFILE  
10 sec. max.  
250°C max.  
220°C  
250°C  
A
200°C  
150°C  
100°C  
50°C  
130°C ~ 180°C  
C
B
D
Time above 220°C -  
30 ~ 90 sec. max.  
60 ~ 90 sec.  
Time (seconds)  
®
NIC COMPONENTS CORP. www.niccomp.com www.lowESR.com www.RFpassives.com www.SMTmagnetics.com  
15  

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