NTHL082N65S3F
ABSOLUTE MAXIMUM RATINGS (T = 25°C, Unless otherwise noted)
C
Symbol
Parameter
NTHL082N65S3F
Unit
V
V
DSS
V
GSS
Drain to Source Voltage
Gate to Source Voltage
650
30
− DC
V
− AC (f > 1 Hz)
30
I
D
Drain Current
− Continuous (T = 25°C)
40
A
C
− Continuous (T = 100°C)
25.5
100
C
I
Drain Current
− Pulsed (Note 1)
A
mJ
A
DM
E
Single Pulsed Avalanche Energy (Note 2)
Avalanche Current (Note 2)
Repetitive Avalanche Energy (Note 1)
MOSFET dv/dt
510
AS
AS
I
4.8
E
3.13
100
mJ
V/ns
AR
dv/dt
Peak Diode Recovery dv/dt (Note 3)
Power Dissipation
50
P
(T = 25°C)
313
W
W/°C
°C
D
C
− Derate Above 25°C
2.5
T , T
Operating and Storage Temperature Range
−55 to +150
300
J
STG
T
Maximum Lead Temperature for Soldering, 1/8″ from Case for 5 seconds
°C
L
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. Repetitive rating: pulse−width limited by maximum junction temperature.
2. I = 4.8 A, R = 25 W, starting T = 25°C.
AS
G
J
3. I ≤ 20 A, di/dt ≤ 200 A/ms, V ≤ 400 V, starting T = 25°C.
SD
DD
J
THERMAL CHARACTERISTICS
Symbol
Parameter
NTHL082N65S3F
Unit
R
Thermal Resistance, Junction to Case, Max.
Thermal Resistance, Junction to Ambient, Max.
0.4
40
_C/W
q
JC
JA
R
q
PACKAGE MARKING AND ORDERING INFORMATION
Part Number
Top Marking
Package
Packing Method
Reel Size
N/A
Tape Width
Quantity
NTHL082N65S3F
NTHL082N65S3F
TO−247
Tube
N/A
30 Units
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