NTA4151P, NTE4151P
Small Signal MOSFET
−20 V, −760 mA, Single P−Channel,
Gate Zener, SC−75, SC−89
Features
http://onsemi.com
• Low R
for Higher Efficiency and Longer Battery Life
DS(on)
V
R
TYP
I MAX
D
• Small Outline Package (1.6 x 1.6 mm)
• SC−75 Standard Gullwing Package
• ESD Protected Gate
(BR)DSS
DS(on)
0.26 W @ −4.5 V
0.35 W @ −2.5 V
0.49 W @ −1.8 V
−20 V
−760 mA
• Pb−Free Packages are Available
Applications
• High Side Load Switch
• DC−DC Conversion
• Small Drive Circuits
P−Channel MOSFET
D
• Battery Operated Systems such as Cell Phones, PDAs, Digital
Cameras, etc.
MAXIMUM RATINGS (T = 25°C unless otherwise stated)
J
G
Parameter
Drain−to−Source Voltage
Symbol
Value Units
V
−20
6.0
V
V
DSS
S
Gate−to−Source Voltage
V
GS
Continuous Drain Current
(Note 1)
Steady State
I
−760
mA
D
MARKING DIAGRAM
& PIN ASSIGNMENT
Power Dissipation (Note 1)
P
mW
D
3
SC−75
SC−89
301
313
Steady State
2
Pulsed Drain Current
tp =10 ms
I
1000
mA
DM
3
1
Drain
SC−75 / SOT−416
CASE 463
Operating Junction and Storage Temperature
T ,
−55 to
150
°C
J
T
STG
STYLE 5
xx M G
Continuous Source Current (Body Diode)
I
−250
260
mA
S
G
Lead Temperature for Soldering Purposes
(1/8 in from case for 10 s)
°C
T
3
L
2
1
2
1
Gate−to−Source ESD Rating −
ESD
1800
V
Source
Gate
(Human Body Model, Method 3015)
SC−89
CASE 463C
THERMAL RESISTANCE RATINGS
Junction−to−Ambient − Steady State (Note 1)
R
q
JA
°C/W
SC−75
SC−89
415
400
xx
M
G
= Device Code
= Date Code*
= Pb−Free Package
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Surface mounted on FR4 board using 1 in sq pad size (Cu area = 1.127 in sq
[1 oz] including traces).
(Note: Microdot may be in either location)
*Date Code orientation may vary depending
upon manufacturing location.
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 2 of this data sheet.
©
Semiconductor Components Industries, LLC, 2006
1
Publication Order Number:
September, 2006 − Rev. 5
NTA4151P/D