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NTE4151P PDF预览

NTE4151P

更新时间: 2024-11-04 10:30:27
品牌 Logo 应用领域
安森美 - ONSEMI
页数 文件大小 规格书
6页 67K
描述
Small Signal MOSFET −20 V, −760 mA, Single P−Channel, Gate Zener, SC−75, SC−89

NTE4151P 数据手册

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NTA4151P, NTE4151P  
Small Signal MOSFET  
−20 V, 760 mA, Single P−Channel,  
Gate Zener, SC−75, SC−89  
Features  
http://onsemi.com  
Low R  
for Higher Efficiency and Longer Battery Life  
DS(on)  
V
R
TYP  
I MAX  
D
Small Outline Package (1.6 x 1.6 mm)  
SC−75 Standard Gullwing Package  
ESD Protected Gate  
(BR)DSS  
DS(on)  
0.26 W @ −4.5 V  
0.35 W @ −2.5 V  
0.49 W @ −1.8 V  
−20 V  
−760 mA  
Pb−Free Packages are Available  
Applications  
High Side Load Switch  
DC−DC Conversion  
Small Drive Circuits  
P−Channel MOSFET  
D
Battery Operated Systems such as Cell Phones, PDAs, Digital  
Cameras, etc.  
MAXIMUM RATINGS (T = 25°C unless otherwise stated)  
J
G
Parameter  
Drain−to−Source Voltage  
Symbol  
Value Units  
V
−20  
6.0  
V
V
DSS  
S
Gate−to−Source Voltage  
V
GS  
Continuous Drain Current  
(Note 1)  
Steady State  
I
−760  
mA  
D
MARKING DIAGRAM  
& PIN ASSIGNMENT  
Power Dissipation (Note 1)  
P
mW  
D
3
SC−75  
SC−89  
301  
313  
Steady State  
2
Pulsed Drain Current  
tp =10 ms  
I
1000  
mA  
DM  
3
1
Drain  
SC−75 / SOT−416  
CASE 463  
Operating Junction and Storage Temperature  
T ,  
−55 to  
150  
°C  
J
T
STG  
STYLE 5  
xx M G  
Continuous Source Current (Body Diode)  
I
−250  
260  
mA  
S
G
Lead Temperature for Soldering Purposes  
(1/8 in from case for 10 s)  
°C  
T
3
L
2
1
2
1
Gate−to−Source ESD Rating −  
ESD  
1800  
V
Source  
Gate  
(Human Body Model, Method 3015)  
SC−89  
CASE 463C  
THERMAL RESISTANCE RATINGS  
Junction−to−Ambient − Steady State (Note 1)  
R
q
JA  
°C/W  
SC−75  
SC−89  
415  
400  
xx  
M
G
= Device Code  
= Date Code*  
= Pb−Free Package  
Stresses exceeding Maximum Ratings may damage the device. Maximum  
Ratings are stress ratings only. Functional operation above the Recommended  
Operating Conditions is not implied. Extended exposure to stresses above the  
Recommended Operating Conditions may affect device reliability.  
1. Surface mounted on FR4 board using 1 in sq pad size (Cu area = 1.127 in sq  
[1 oz] including traces).  
(Note: Microdot may be in either location)  
*Date Code orientation may vary depending  
upon manufacturing location.  
ORDERING INFORMATION  
See detailed ordering and shipping information in the package  
dimensions section on page 2 of this data sheet.  
©
Semiconductor Components Industries, LLC, 2006  
1
Publication Order Number:  
September, 2006 − Rev. 5  
NTA4151P/D  
 

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