NTE2995
MOSFET
N−Channel, Enhancement Mode
High Speed Switch
Features:
D RDS(on) = 0.65Ω Typical
D
S
D Extremely High dv/dt Capability
D Gate Charge Minimized
D Gate−to−Source Zener Diode Protected
Applications:
D High Current, High Speed Switching
D Ideal for Off−Line Power Supplies, Adaptor and PFC
D Lighting
G
Absolute Maximum Ratings:
Drain−Source Voltage (VGS = 0), VDS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 600V
Drain−Gate Voltage (RGS = 20kΩ), VDGR . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 600V
Gate−Source Voltage, VGS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±30V
Drain Current, ID
Continuous
TC = +25°C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10A
TC = +100°C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.7A
Pulsed (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36A
Total Power Dissiption (TC = +25°C), PTOT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 115W
Derate Above +25°C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.92W/°C
Gate−Source ESD Voltage (HBM C = 100pF, R = 1.5kΩ), Vesd(G−S) . . . . . . . . . . . . . . . . . . . . . 4000V
Peak Diode Recovery Voltage Slope (Note 2), dv/dt . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4.5V/ns
Avalanche Current, Repetitive or Non−Repetitive (Pulse Width Limited by TJmax), IAR . . . . . . . 9A
Single Pulse Avalanche Energy (Starting TJ = +25°C, ID = IAR, VDD = 50V), EAS . . . . . . . . . 300mJ
Repetitive Avalanche Energy (Pulse Width Limited by TJmax), EAR . . . . . . . . . . . . . . . . . . . . . 3.5mJ
Minimum Gate−Source Breakdown Voltage (IGS = ±1mA, Open Drain, Note 3), V(BR)GSO . . . . 30V
Operating Junction Temperature Range, TJ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −55° to +150°C
Storage Temperature Range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −55° to +150°C
Thermal Resistance, Junction−to−Case, RthJC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.09°C/W
Thermal Resistance, Junction−to−Ambient, RthJA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62.5°C/W
Lead Temperature (During Soldering), TL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +300°C
Note 1. Pulse width limited by safe operating area.
Note 2. ISD ≤ 10A, di/dt ≤ 200A/µs, VDD ≤ V(BR)DSS, TJ ≤ TJmax.
Note 3. The built−in back−to−back Zener diodes have specifically been designed to enhance not
only the device’s ESD capability, but also to make them safely absorb possible voltage tran-
sients that may occasionally be applied from gate to source. In this respect their Zener volt-
age is appropriate to achieve an efficient and cost−effective intervention to protect the de-
vice’s integrity. These integrated Zener diodes thus avoid the usage of external components.