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NLV74HC74ADTR2G PDF预览

NLV74HC74ADTR2G

更新时间: 2024-11-10 01:13:11
品牌 Logo 应用领域
安森美 - ONSEMI /
页数 文件大小 规格书
7页 116K
描述
Dual D Flip-Flop with Set and Reset

NLV74HC74ADTR2G 数据手册

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MC74HC74A  
Dual D Flip-Flop with Set  
and Reset  
High−Performance Silicon−Gate CMOS  
The MC74HC74A is identical in pinout to the LS74. The device  
inputs are compatible with standard CMOS outputs; with pullup  
resistors, they are compatible with LSTTL outputs.  
http://onsemi.com  
This device consists of two D flip−flops with individual Set, Reset,  
and Clock inputs. Information at a D−input is transferred to the  
corresponding Q output on the next positive going edge of the clock  
input. Both Q and Q outputs are available from each flip−flop. The Set  
and Reset inputs are asynchronous.  
SOIC−14 NB  
D SUFFIX  
CASE 751A  
TSSOP−14  
DT SUFFIX  
CASE 948G  
PIN ASSIGNMENT  
Features  
RESET 1  
DATA 1  
1
2
14  
13 RESET 2  
12  
V
Output Drive Capability: 10 LSTTL Loads  
CC  
Outputs Directly Interface to CMOS, NMOS, and TTL  
Operating Voltage Range: 2.0 to 6.0 V  
3
4
CLOCK 1  
SET 1  
DATA 2  
Low Input Current: 1.0 mA  
11 CLOCK 2  
10 SET 2  
High Noise Immunity Characteristic of CMOS Devices  
In Compliance with the JEDEC Standard No. 7.0 A Requirements  
Chip Complexity: 128 FETs or 32 Equivalent Gates  
Q1  
Q1  
5
6
7
9
8
Q2  
Q2  
GND  
NLV Prefix for Automotive and Other Applications Requiring  
Unique Site and Control Change Requirements; AEC−Q100  
Qualified and PPAP Capable  
MARKING DIAGRAMS  
These Devices are Pb−Free, Halogen Free and are RoHS Compliant  
14  
HC74AG  
AWLYWW  
LOGIC DIAGRAM  
1
RESET 1  
1
5
6
SOIC−14 NB  
2
3
DATA 1  
Q1  
Q1  
CLOCK 1  
14  
HC  
74A  
ALYWG  
G
4
SET 1  
13  
RESET 2  
1
9
8
TSSOP−14  
12  
11  
DATA 2  
Q2  
Q2  
A
L, WL  
Y, YY  
= Assembly Location  
= Wafer Lot  
= Year  
CLOCK 2  
10  
SET 2  
W, WW = Work Week  
PIN 14 = V  
CC  
PIN 7 = GND  
G or G  
= Pb−Free Package  
(Note: Microdot may be in either location)  
ORDERING INFORMATION  
See detailed ordering and shipping information in the package  
dimensions section on page 4 of this data sheet.  
© Semiconductor Components Industries, LLC, 2014  
1
Publication Order Number:  
August, 2014 − Rev. 14  
MC74HC74A/D  

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