是否无铅: | 含铅 | 是否Rohs认证: | 不符合 |
生命周期: | Contact Manufacturer | 零件包装代码: | QFP |
包装说明: | , | 针数: | 100 |
Reach Compliance Code: | unknown | 风险等级: | 5.8 |
JESD-30 代码: | S-PQFP-G100 | JESD-609代码: | e0 |
端子数量: | 100 | 封装主体材料: | PLASTIC/EPOXY |
封装形状: | SQUARE | 封装形式: | FLATPACK |
峰值回流温度(摄氏度): | NOT SPECIFIED | 认证状态: | Not Qualified |
表面贴装: | YES | 技术: | CMOS |
端子面层: | TIN LEAD | 端子形式: | GULL WING |
端子位置: | QUAD | 处于峰值回流温度下的最长时间: | NOT SPECIFIED |
uPs/uCs/外围集成电路类型: | MICROPROCESSOR | Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
NG80386SXLV-25 | AMD |
获取价格 |
High-Performance, Low-Power, Embedded Microprocessors | |
NG80486DXLV-33 | ETC |
获取价格 |
32-Bit Microprocessor | |
NG80486DXLV-33F | ETC |
获取价格 |
32-Bit Microprocessor | |
NG80486DXLV-33S | ETC |
获取价格 |
32-Bit Microprocessor | |
NG80486SLENHANCED1XCLKDX33 | INTEL |
获取价格 |
Microprocessor, 32-Bit, 33MHz, CMOS, PQFP196, HEAT SPREADER, BUMPERED, PLASTIC, FQFP-196 | |
NG80486SLENHANCED1XCLKSX25 | INTEL |
获取价格 |
Microprocessor, 32-Bit, 25MHz, CMOS, PQFP196, HEAT SPREADER, BUMPERED, PLASTIC, FQFP-196 | |
NG80486SLENHANCED1XCLKSX33 | INTEL |
获取价格 |
Microprocessor, 32-Bit, 33MHz, CMOS, PQFP196, HEAT SPREADER, BUMPERED, PLASTIC, FQFP-196 | |
NG80486SLENHANCED2XCLKDX33 | INTEL |
获取价格 |
Microprocessor, 32-Bit, 33MHz, CMOS, PQFP196, HEAT SPREADER, BUMPERED, PLASTIC, FQFP-196 | |
NG80486SLENHANCED2XCLKSX33 | INTEL |
获取价格 |
Microprocessor, 32-Bit, 33MHz, CMOS, PQFP196, HEAT SPREADER, BUMPERED, PLASTIC, FQFP-196 | |
NG80486SX16 | INTEL |
获取价格 |
Microprocessor, 32-Bit, 16MHz, CMOS, PQFP196, HEAT SPREADER, BUMPERED, PLASTIC, FQFP-196 |