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NE3513M04 PDF预览

NE3513M04

更新时间： 2022-11-27 11:12:52
品牌 Logo 应用领域
瑞萨 - RENESAS /
页数 文件大小 规格书
10页 221K
描述
N-Channel GaAs HJ-FET, X to Ku Band Low Noise and High-Gain

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中文翻译

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NE3513M04 数据手册

 浏览型号NE3513M04的Datasheet PDF文件第4页浏览型号NE3513M04的Datasheet PDF文件第5页浏览型号NE3513M04的Datasheet PDF文件第6页浏览型号NE3513M04的Datasheet PDF文件第8页浏览型号NE3513M04的Datasheet PDF文件第9页浏览型号NE3513M04的Datasheet PDF文件第10页 
NE3513M04  
RECOMMENDED SOLDERING CONDITIONS  
This product should be soldered and mounted under the following recommended conditions. For soldering methods and  
conditions other than those recommended below, contact your nearby sales office.  
Soldering Method  
Soldering Conditions  
Condition Symbol  
Infrared Reflow  
Peak temperature (package surface temperature) : 260°C or below  
IR260  
Time at peak temperature  
: 10 seconds or less  
: 60 seconds or less  
: 120 30 seconds  
: 3 times  
Time at temperature of 220°C or higher  
Preheating time at 120 to 180°C  
Maximum number of reflow processes  
Maximum chlorine content of rosin flux (% mass) : 0.2% (Wt.) or below  
Partial Heating  
Peak temperature (terminal temperature)  
Soldering time (per side of device)  
: 350°C or below  
: 3 seconds or less  
HS350  
Maximum chlorine content of rosin flux (% mass) : 0.2% (Wt.) or below  
CAUTION  
Do not use different soldering methods together (except for partial heating).  
R09DS0028EJ0100 Rev.1.00  
Oct 18, 2011  
Page 7 of 8  
1...45678910

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