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NDS352AP PDF预览

NDS352AP

更新时间: 2024-11-17 22:29:07
品牌 Logo 应用领域
飞兆/仙童 - FAIRCHILD 晶体小信号场效应晶体管开关光电二极管PC
页数 文件大小 规格书
6页 81K
描述
P-Channel Logic Level Enhancement Mode Field Effect Transistor

NDS352AP 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Transferred零件包装代码:SSOT
包装说明:SMALL OUTLINE, R-PDSO-G3针数:3
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8541.21.00.95风险等级:3.3
Samacsys Confidence:2Samacsys Status:Released
Samacsys PartID:999142Samacsys Pin Count:3
Samacsys Part Category:MOSFET (P-Channel)Samacsys Package Category:SOT23 (3-Pin)
Samacsys Footprint Name:SOT-23 (TO-236)Samacsys Released Date:2018-02-22 15:33:36
Is Samacsys:N其他特性:LOGIC LEVEL COMPATIBLE
配置:SINGLE WITH BUILT-IN DIODE最小漏源击穿电压:30 V
最大漏极电流 (Abs) (ID):0.9 A最大漏极电流 (ID):0.9 A
最大漏源导通电阻:0.3 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JESD-30 代码:R-PDSO-G3JESD-609代码:e3
湿度敏感等级:1元件数量:1
端子数量:3工作模式:ENHANCEMENT MODE
最高工作温度:150 °C封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
峰值回流温度(摄氏度):NOT SPECIFIED极性/信道类型:P-CHANNEL
最大功率耗散 (Abs):0.5 W认证状态:Not Qualified
子类别:Other Transistors表面贴装:YES
端子面层:Matte Tin (Sn)端子形式:GULL WING
端子位置:DUAL处于峰值回流温度下的最长时间:NOT SPECIFIED
晶体管应用:SWITCHING晶体管元件材料:SILICON
Base Number Matches:1

NDS352AP 数据手册

 浏览型号NDS352AP的Datasheet PDF文件第2页浏览型号NDS352AP的Datasheet PDF文件第3页浏览型号NDS352AP的Datasheet PDF文件第4页浏览型号NDS352AP的Datasheet PDF文件第5页浏览型号NDS352AP的Datasheet PDF文件第6页 
February 1997  
NDS352AP  
P-Channel Logic Level Enhancement Mode Field Effect Transistor  
General Description  
Features  
These P -Channel logic level enhancement mode power field  
effect transistors are produced using Fairchild's proprietary,  
high cell density, DMOS technology. This very high density  
process is especially tailored to minimize on-state resistance.  
These devices are particularly suited for low voltage applications  
such as notebook computer power management, portable  
electronics, and other battery powered circuits where fast  
high-side switching, and low in-line power loss are needed in a  
very small outline surface mount package.  
-0.9 A, -30 V. RDS(ON) = 0.5 W @ VGS = -4.5 V  
RDS(ON) = 0.3 W @ VGS = -10 V.  
Industry standard outline SOT-23 surface mount package  
using proprietary SuperSOTTM-3 design for superior thermal  
and electrical capabilities.  
High density cell design for extremely low RDS(ON)  
.
Exceptional on-resistance and maximum DC current  
capability.  
________________________________________________________________________________  
D
S
G
Absolute Maximum Ratings  
TA = 25°C unless otherwise noted  
Symbol Parameter  
NDS352AP  
-30  
Units  
Drain-Source Voltage  
V
V
A
VDSS  
VGSS  
ID  
Gate-Source Voltage - Continuous  
±20  
±0.9  
Maximum Drain Current - Continuous  
- Pulsed  
(Note 1a)  
±10  
PD  
Maximum Power Dissipation  
(Note 1a)  
(Note 1b)  
0.5  
W
0.46  
Operating and Storage Temperature Range  
-55 to 150  
°C  
TJ,TSTG  
THERMAL CHARACTERISTICS  
Thermal Resistance, Junction-to-Ambient  
(Note 1a)  
(Note 1)  
250  
75  
°C/W  
°C/W  
R
JA  
q
Thermal Resistance, Junction-to-Case  
R
JC  
q
© 1997 Fairchild Semiconductor Corporation  
NDS352AP Rev.D  

NDS352AP 替代型号

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