NCP81042
Precise Low Voltage
Synchronous Buck
Controller with Power
Saving Mode
http://onsemi.com
The NCP81042 is a simple single phase solution with differential
phase current sensing, power saving operation, and gate drivers to
provide accurately regulated power.
MARKING
DIAGRAMS
The adaptive non overlap gate drive and power saving operation
circuit provide a low switching loss and high efficiency solution for
server, notebook, and desktop systems. A high performance
operational error amplifier is provided to simplify compensation of the
system. The NCP81042 features also include soft−start sequence,
accurate overvoltage and over current protection, UVLO for VCC and
VCCP, and thermal shutdown.
81042
ALYWG
G
QFN16
CASE 485G
1
81042 = Specific Device Code
A
L
Y
W
G
= Assembly Location
= Wafer Lot
Features
= Year
• High Performance Operational Error Amplifier
• Internal Soft−Start/Stop
= Work Week
= Pb−Free Package
•
0.5% Internal Voltage Accuracy, 0.8 V voltage reference
(*Note: Microdot may be in either location)
• OCP accuracy, Four Re−entry Times Before Latch
• “Lossless” Differential Inductor Current Sensing
• Internal High Precision Current Sensing Amplifier
• Oscillator Frequency Range of 100 kHz − 1000 kHz
• 20 ns Adaptive FET Non−overlap Time of Internal Gate Driver
• 5.0 V to 12 V Operation
PIN CONNECTIONS
16
15
14
13
• Support 1.5 V to 19 V V
in
• V from 0.8 V to 3.3 V (5 V with 12 V
)
CC
1
2
3
4
12
11
10
9
out
VCCP
LG
CSN/VO
FBG
• Chip Enable through OSC pin
• Latched Over Voltage Protection (OVP)
• Internally Fixed OCP Threshold
LX
VSEN
FB
• Guaranteed Startup Into Pre−Charged Loads
• Thermally Compensated Current Monitoring
• Thermal Shutdown Protection
BOOT
5
6
7
8
• Integrated MOSFET Drivers
• Integrated BOOST Diode with internal R = 2.2 W
bst
• Automatic Power Saving Mode to Maximize Efficiency During Light
(Top View)
Load Operation
• Sync Function
• Remote Ground Sensing
• This is a Pb−Free Device*
ORDERING INFORMATION
Device
Package
Shipping
NCP81042MNTXG
QFN16
(Pb−Free)
3000 / Tape &
Reel
Applications
• Desktop and Server Systems
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2012
1
Publication Order Number:
August, 2012 − Rev. P0
NCP81042/D