是否Rohs认证: | 符合 | 生命周期: | Obsolete |
零件包装代码: | BGA | 包装说明: | FLIP CHIP, CSP-9 |
针数: | 9 | Reach Compliance Code: | compliant |
ECCN代码: | EAR99 | HTS代码: | 8542.33.00.01 |
风险等级: | 5.63 | 商用集成电路类型: | AUDIO AMPLIFIER |
JESD-30 代码: | S-PBGA-B9 | JESD-609代码: | e1 |
长度: | 1.45 mm | 湿度敏感等级: | 1 |
信道数量: | 1 | 功能数量: | 1 |
端子数量: | 9 | 最高工作温度: | 85 °C |
最低工作温度: | -40 °C | 标称输出功率: | 1.08 W |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | VFBGA |
封装形状: | SQUARE | 封装形式: | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
峰值回流温度(摄氏度): | 235 | 认证状态: | Not Qualified |
座面最大高度: | 0.66 mm | 最大供电电压 (Vsup): | 5.5 V |
最小供电电压 (Vsup): | 2.2 V | 表面贴装: | YES |
温度等级: | INDUSTRIAL | 端子面层: | Tin/Silver/Copper (Sn/Ag/Cu) |
端子形式: | BALL | 端子节距: | 0.5 mm |
端子位置: | BOTTOM | 处于峰值回流温度下的最长时间: | NOT SPECIFIED |
宽度: | 1.45 mm | Base Number Matches: | 1 |
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