是否Rohs认证: | 不符合 | 生命周期: | Obsolete |
零件包装代码: | BGA | 包装说明: | VFBGA, |
针数: | 9 | Reach Compliance Code: | compliant |
ECCN代码: | EAR99 | HTS代码: | 8542.33.00.01 |
风险等级: | 5.85 | 商用集成电路类型: | AUDIO AMPLIFIER |
JESD-30 代码: | S-PBGA-B9 | JESD-609代码: | e0 |
长度: | 1.45 mm | 信道数量: | 1 |
功能数量: | 1 | 端子数量: | 9 |
最高工作温度: | 85 °C | 最低工作温度: | -40 °C |
标称输出功率: | 1.08 W | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | VFBGA | 封装形状: | SQUARE |
封装形式: | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | 峰值回流温度(摄氏度): | 240 |
认证状态: | Not Qualified | 座面最大高度: | 0.66 mm |
最大供电电压 (Vsup): | 5.5 V | 最小供电电压 (Vsup): | 2.2 V |
表面贴装: | YES | 温度等级: | INDUSTRIAL |
端子面层: | TIN LEAD | 端子形式: | BALL |
端子节距: | 0.5 mm | 端子位置: | BOTTOM |
处于峰值回流温度下的最长时间: | 30 | 宽度: | 1.45 mm |
Base Number Matches: | 1 |
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