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NAND01GW3B2BN6F PDF预览

NAND01GW3B2BN6F

更新时间: 2024-02-27 06:01:15
品牌 Logo 应用领域
意法半导体 - STMICROELECTRONICS 闪存存储内存集成电路光电二极管
页数 文件大小 规格书
62页 713K
描述
1 Gbit, 2 Gbit, 2112 Byte/1056 Word Page, 1.8V/3V, NAND Flash Memory

NAND01GW3B2BN6F 技术参数

生命周期:Obsolete零件包装代码:TSOP
包装说明:12 X 20 MM, PLASTIC, TSOP-48针数:48
Reach Compliance Code:unknownECCN代码:3A991.B.1.A
HTS代码:8542.32.00.51风险等级:5.83
JESD-30 代码:R-PDSO-G48长度:18.4 mm
内存密度:1073741824 bit内存集成电路类型:FLASH
内存宽度:8功能数量:1
端子数量:48字数:134217728 words
字数代码:128000000工作模式:ASYNCHRONOUS
最高工作温度:85 °C最低工作温度:-40 °C
组织:128MX8封装主体材料:PLASTIC/EPOXY
封装代码:TSSOP封装形状:RECTANGULAR
封装形式:SMALL OUTLINE, THIN PROFILE, SHRINK PITCH并行/串行:PARALLEL
编程电压:3 V座面最大高度:1.2 mm
最大供电电压 (Vsup):3.6 V最小供电电压 (Vsup):2.7 V
标称供电电压 (Vsup):3 V表面贴装:YES
技术:CMOS温度等级:INDUSTRIAL
端子形式:GULL WING端子节距:0.5 mm
端子位置:DUAL类型:NAND TYPE
宽度:12 mmBase Number Matches:1

NAND01GW3B2BN6F 数据手册

 浏览型号NAND01GW3B2BN6F的Datasheet PDF文件第4页浏览型号NAND01GW3B2BN6F的Datasheet PDF文件第5页浏览型号NAND01GW3B2BN6F的Datasheet PDF文件第6页浏览型号NAND01GW3B2BN6F的Datasheet PDF文件第8页浏览型号NAND01GW3B2BN6F的Datasheet PDF文件第9页浏览型号NAND01GW3B2BN6F的Datasheet PDF文件第10页 
NAND01G-B2B, NAND02G-B2C  
Description  
1
Description  
ST NAND01G-B2B and NAND02G-B2C Flash 2112 Byte/ 1056 Word Page is a family of  
non-volatile Flash memories that uses NAND cell technology. The devices range from 1 Gbit  
to 2 Gbits and operate with either a 1.8V or 3V voltage supply. The size of a Page is either  
2112 Bytes (2048 + 64 spare) or 1056 Words (1024 + 32 spare) depending on whether the  
device has a x8 or x16 bus width.  
The address lines are multiplexed with the Data Input/Output signals on a multiplexed x8 or  
x16 Input/Output bus. This interface reduces the pin count and makes it possible to migrate  
to other densities without changing the footprint.  
Each block can be programmed and erased over 100,000 cycles. To extend the lifetime of  
NAND Flash devices it is strongly recommended to implement an Error Correction Code  
(ECC).  
The devices feature a Write Protect pin that allows performing hardware protection against  
program and erase operations.  
The devices feature an open-drain Ready/Busy output that can be used to identify if the  
Program/Erase/Read (P/E/R) Controller is currently active. The use of an open-drain output  
allows the Ready/Busy pins from several memories to be connected to a single pull-up  
resistor.  
A Copy Back Program command is available to optimize the management of defective  
blocks. When a Page Program operation fails, the data can be programmed in another page  
without having to resend the data to be programmed.  
Each device has Cache Program and Cache Read features which improve the program and  
read throughputs for large files. During Cache Programming, the device loads the data in a  
Cache Register while the previous data is transferred to the Page Buffer and programmed  
into the memory array. During Cache Reading, the device loads the data in a Cache  
Register while the previous data is transferred to the I/O Buffers to be read.  
All devices have the Chip Enable Don’t Care feature, which allows code to be directly  
downloaded by a microcontroller, as Chip Enable transitions during the latency time do not  
stop the read operation.  
All devices have the option of a Unique Identifier (serial number), which allows each device  
to be uniquely identified.  
The Unique Identifier options is subject to an NDA (Non Disclosure Agreement) and so not  
described in the datasheet. For more details of this option contact your nearest ST Sales  
office.  
The devices are available in the following packages:  
TSOP48 (12 x 20mm)  
VFBGA63 (9.5 x 12 x 1mm, 0.8mm pitch) for NAND02G-B2C devices.  
VFBGA63 (9 x 11 x 1mm, 0.8mm pitch) for NAND01G-B2B devices.  
In order to meet environmental requirements, ST offers the NAND01G-B2B and NAND02G-  
®
B2C in ECOPACK packages. ECOPACK packages are Lead-free. The category of second  
Level Interconnect is marked on the package and on the inner box label, in compliance with  
JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also  
marked on the inner box label. ECOPACK is an ST trademark.  
7/62  

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