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MXP1152

更新时间: 2024-11-10 22:45:43
品牌 Logo 应用领域
美高森美 - MICROSEMI 晶体晶体管
页数 文件大小 规格书
1页 33K
描述
NPN Photo Transistor Hybrid Optocoupler

MXP1152 技术参数

是否无铅: 含铅是否Rohs认证: 不符合
生命周期:ActiveReach Compliance Code:compliant
HTS代码:8541.40.80.00风险等级:5.88
Coll-Emtr Bkdn Voltage-Min:20 V配置:SINGLE
标称电流传输比:100%最大暗电源:100 nA
JESD-609代码:e0元件数量:1
光电设备类型:TRANSISTOR OUTPUT OPTOCOUPLER端子面层:Tin/Lead (Sn/Pb)
Base Number Matches:1

MXP1152 数据手册

  
2830 S. Fairview St.  
Santa Ana, CA 92704  
PH: 714.979.8220  
FAX: 714.557.5989  
MXP1152  
NPN Photo Transistor Hybrid Optocoupler  
Features  
Small size  
Gold thick film bonding pads  
Custom input and output versions  
B
C
A
• Low input current operation  
Applications  
Solid state relays  
Switching power supplies  
CMOS drivers  
Light meters  
C
E
Electrical Characteristics @ 25oC  
SYMBOL  
CHARACTERISTIC  
CONDITIONS  
MIN  
TYP  
100  
MAX UNITS  
%
CTR  
Current Transfer Ratio  
IF = 10 mA, VCE = 5.0 V  
50  
VCE(SAT) Collector-Emitter Saturation Voltage IF = 10 mA, IC = 1.0 mA  
0.25  
Volts  
BVCEO  
ICEO  
VF  
Collector-Emitter Voltage  
Collector-Emitter Leakage Current  
Input Forward Voltage  
IC = 100 uA  
VCE = 20 V  
IF = 10 mA  
VR = 3.0 V  
20  
Volts  
100 nAmps  
0.85  
1.2  
1.95  
Volts  
IR  
Input Reverse Current  
100 uAmps  
IF = 20 mA, VCE = 5 V,  
RL = 100 Ohms  
T(on)  
Turn-On Time  
30  
usec  
Notes:  
1
A
Collector 1. Fritless gold over Pt-Au or Pd-Au metallization  
2. Pt-Au or Pd-Au metallization  
1
1
Base .085  
2
hybrid substrate size  
0.105 x 0.085 inch  
1
wirebond contact size  
1
C
Emitter  
0.010 x 0.010 inch  
.105  
Data Sheet # MSC  
Updated:May 1999  
O p t o P r o d u c t s  

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