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MXLSMBJ2K3.0TR PDF预览

MXLSMBJ2K3.0TR

更新时间: 2024-11-23 20:04:43
品牌 Logo 应用领域
美高森美 - MICROSEMI 局域网光电二极管电视
页数 文件大小 规格书
4页 306K
描述
2000W, UNIDIRECTIONAL, SILICON, TVS DIODE, DO-214AA, PLASTIC PACKAGE-2

MXLSMBJ2K3.0TR 技术参数

是否无铅: 含铅是否Rohs认证: 不符合
生命周期:Obsolete零件包装代码:DO-214AA
包装说明:R-PDSO-J2针数:2
Reach Compliance Code:unknownECCN代码:EAR99
HTS代码:8541.10.00.50风险等级:5.92
其他特性:HIGH RELIABILITY最小击穿电压:4.3 V
最大钳位电压:5.4 V配置:SINGLE
二极管元件材料:SILICON二极管类型:TRANS VOLTAGE SUPPRESSOR DIODE
JEDEC-95代码:DO-214AAJESD-30 代码:R-PDSO-J2
JESD-609代码:e0湿度敏感等级:1
最大非重复峰值反向功率耗散:2000 W元件数量:1
端子数量:2封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
峰值回流温度(摄氏度):NOT SPECIFIED极性:UNIDIRECTIONAL
最大功率耗散:1.38 W认证状态:Not Qualified
最大重复峰值反向电压:3 V子类别:Transient Suppressors
表面贴装:YES技术:AVALANCHE
端子面层:TIN LEAD端子形式:J BEND
端子位置:DUAL处于峰值回流温度下的最长时间:NOT SPECIFIED
Base Number Matches:1

MXLSMBJ2K3.0TR 数据手册

 浏览型号MXLSMBJ2K3.0TR的Datasheet PDF文件第2页浏览型号MXLSMBJ2K3.0TR的Datasheet PDF文件第3页浏览型号MXLSMBJ2K3.0TR的Datasheet PDF文件第4页 
TECHNICAL DATA SHEET  
Gort Road Business Park, Ennis, Co. Clare, Ireland.  
Tel: +353 (0) 65 6840044, Fax: +353 (0) 65 6822298  
6 Lake Street, Lawrence, MA 01841  
Tel: 1-800-446-1158 / (978) 794-1666, Fax: (978) 6890803  
Website: http://www.microsemi.com  
- High Reliability controlled devices  
Surface Mount 2 kW  
- Unidirectional construction  
Transient Voltage Suppressor  
- Available in both J-bend and Gull-wing terminations  
- Selections for 3 V to 5 V standoff voltages (VWM)  
LEVELS  
M, MA, MX, MXL  
DEVICES  
MSMBJ2K3.0 thru MSMBJ2K5.0, e3  
MSMBG2K3.0 thru MSMBG2K5.0,e3  
FEATURES  
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.
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High reliability controlled devices with wafer fabrication and assembly lot traceability  
100 % surge tested devices  
Suppresses transients up to 2 kW @ 8/20 µs  
Optional upscreening available by replacing the M prefix with MA, MX or MXL. These prefixes  
specify various screening and conformance inspection options based on MIL-PRF-19500.  
Refer to MicroNote 129 for more details on the screening options.  
.
.
Moisture classification is Level 1 with no dry pack required per IPC/JEDEC J-STD-020B  
3σ lot norm screening performed on Standby Current ID  
APPLICATIONS / BENEFITS  
.
Voltage and reverse (leakage) current lowest available  
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.
.
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Protects sensitive components such as IC’s, CMOS, Bipolar, BiCMOS, ECL, DTL, T2L, etc.  
Protection from switching transients & induced RF  
Compliant to IEC61000-4-2 and IEC61000-4-4 for ESD and EFT protection respectively  
Secondary lightning protection per IEC61000-4-5 with 42 Ohms source impedance for Class 1  
MAXIMUM RATINGS  
.
.
Peak Pulse Power dissipation at 25 ºC: 2000 W @ 8/20 µs or 300 W @ 10/1000 µs  
with impulse repetition rate (duty factor) of 0.01 maximum (also see Figure 1 and 4)  
Steady-state power dissipation: 5 Watts @ TL 25 °C or 1.38 Watts at TA = 25 °C when  
mounted on FR4 PC board with recommended footprint  
.
.
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Tclamping (0 Volts to VBR min.): <100 ps  
Operating and Storage temperatures: -65°C to +150°C  
Forward Voltage @ 25 °C: 3.5 Volts maximum @ 30 Amp peak impulse of 8.3 ms half-sine  
wave (unidirectional only)  
.
Solder temperatures: 260 °C for 10 s (maximum)  
RF01019 Rev A, November 2010  
High Reliability Product Group  
Page 1 of 4  

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