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MTP33N10E PDF预览

MTP33N10E

更新时间: 2024-01-26 08:36:34
品牌 Logo 应用领域
安森美 - ONSEMI 局域网开关脉冲晶体管
页数 文件大小 规格书
8页 93K
描述
33A, 100V, 0.06ohm, N-CHANNEL, Si, POWER, MOSFET, TO-220AB, CASE 221A-09, 3 PIN

MTP33N10E 技术参数

生命周期:Obsolete零件包装代码:SFM
包装说明:FLANGE MOUNT, R-PSFM-T3针数:3
Reach Compliance Code:unknownECCN代码:EAR99
风险等级:5.25Is Samacsys:N
配置:SINGLE最小漏源击穿电压:100 V
最大漏极电流 (ID):33 A最大漏源导通电阻:0.058 Ω
FET 技术:METAL-OXIDE SEMICONDUCTORJEDEC-95代码:TO-220AB
JESD-30 代码:R-PSFM-T3元件数量:1
端子数量:3工作模式:ENHANCEMENT MODE
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:FLANGE MOUNT极性/信道类型:N-CHANNEL
功耗环境最大值:125 W认证状态:Not Qualified
表面贴装:NO端子形式:THROUGH-HOLE
端子位置:SINGLE晶体管元件材料:SILICON
Base Number Matches:1

MTP33N10E 数据手册

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MTP33N10E  
Preferred Device  
Power MOSFET  
33 Amps, 100 Volts  
N−Channel TO−220  
This Power MOSFET is designed to withstand high energy in the  
avalanche and commutation modes. The energy efficient design also  
offers a drain−to−source diode with a fast recovery time. Designed for  
low voltage, high speed switching applications in power supplies,  
converters and PWM motor controls, these devices are particularly  
well suited for bridge circuits where diode speed and commutating  
safe operating areas are critical and offer additional safety margin  
against unexpected voltage transients.  
http://onsemi.com  
33 AMPERES  
100 VOLTS  
R
DS(on) = 60 m  
Avalanche Energy Specified  
Source−to−Drain Diode Recovery Time Comparable to a  
Discrete Fast Recovery Diode  
N−Channel  
D
Diode is Characterized for Use in Bridge Circuits  
I  
and V  
Specified at Elevated Temperature  
DSS  
DS(on)  
G
MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
C
Rating  
Drain−Source Voltage  
Symbol  
Value  
100  
Unit  
Vdc  
Vdc  
S
V
V
DSS  
Drain−Gate Voltage (R = 1.0 M)  
100  
MARKING DIAGRAM  
GS  
DGR  
& PIN ASSIGNMENT  
Gate−Source Voltage  
− Continuous  
V
V
GSM  
± 20  
± 40  
Vdc  
Vpk  
4
GS  
4
− Non−Repetitive (t 10 ms)  
Drain  
p
Drain Current − Continuous  
Drain Current − Continuous @ 100°C  
Drain Current − Single Pulse (t 10 µs)  
I
I
33  
20  
99  
Adc  
Apk  
D
D
I
DM  
p
TO−220AB  
CASE 221A  
STYLE 5  
Total Power Dissipation  
Derate above 25°C  
P
125  
1.0  
Watts  
W/°C  
D
MTP33N10E  
LLYWW  
Operating and Storage Temperature Range  
T , T  
J
− 55 to  
150  
°C  
stg  
1
2
1
3
3
Gate  
Source  
Single Pulse Drain−to−Source Avalanche  
E
AS  
545  
mJ  
Energy − Starting T = 25°C  
J
2
(V = 25 Vdc, V = 10 Vdc,  
DD  
GS  
Drain  
I = 33 Apk, L = 1.000 mH, R = 25 )  
L
G
Thermal Resistance  
− Junction to Case  
− Junction to Ambient  
°C/W  
°C  
MTP33N10E  
LL  
Y
WW  
= Device Code  
= Location Code  
= Year  
R
R
1.0  
62.5  
θ
JC  
JA  
θ
= Work Week  
Maximum Lead Temperature for Soldering  
T
260  
L
Purposes, 1/8from case for 10 sec.  
ORDERING INFORMATION  
Device  
MTP33N10E  
Package  
Shipping  
50 Units/Rail  
TO−220AB  
Preferred devices are recommended choices for future use  
and best overall value.  
Semiconductor Components Industries, LLC, 2004  
1
Publication Order Number:  
March, 2004 − Rev. 4  
MTP33N10E/D  

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