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MTP16N25E PDF预览

MTP16N25E

更新时间: 2024-11-15 22:29:47
品牌 Logo 应用领域
摩托罗拉 - MOTOROLA 晶体晶体管功率场效应晶体管开关脉冲局域网
页数 文件大小 规格书
8页 225K
描述
TMOS POWER FET 16 AMPERES 250 VOLTS RDS(on) = 0.25 OHM

MTP16N25E 技术参数

生命周期:Transferred包装说明:FLANGE MOUNT, R-PSFM-T3
Reach Compliance Code:unknown风险等级:5.23
Is Samacsys:N其他特性:AVALANCHE RATED
雪崩能效等级(Eas):384 mJ外壳连接:DRAIN
配置:SINGLE WITH BUILT-IN DIODE最小漏源击穿电压:250 V
最大漏极电流 (Abs) (ID):16 A最大漏极电流 (ID):16 A
最大漏源导通电阻:0.25 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
最大反馈电容 (Crss):260 pFJEDEC-95代码:TO-220AB
JESD-30 代码:R-PSFM-T3JESD-609代码:e0
元件数量:1端子数量:3
工作模式:ENHANCEMENT MODE最高工作温度:150 °C
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:FLANGE MOUNT极性/信道类型:N-CHANNEL
功耗环境最大值:125 W最大功率耗散 (Abs):125 W
最大脉冲漏极电流 (IDM):56 A认证状态:Not Qualified
子类别:FET General Purpose Power表面贴装:NO
端子面层:Tin/Lead (Sn/Pb)端子形式:THROUGH-HOLE
端子位置:SINGLE晶体管应用:SWITCHING
晶体管元件材料:SILICON最大关闭时间(toff):200 ns
最大开启时间(吨):160 nsBase Number Matches:1

MTP16N25E 数据手册

 浏览型号MTP16N25E的Datasheet PDF文件第2页浏览型号MTP16N25E的Datasheet PDF文件第3页浏览型号MTP16N25E的Datasheet PDF文件第4页浏览型号MTP16N25E的Datasheet PDF文件第5页浏览型号MTP16N25E的Datasheet PDF文件第6页浏览型号MTP16N25E的Datasheet PDF文件第7页 
Order this document  
by MTP16N25E/D  
SEMICONDUCTOR TECHNICAL DATA  
Motorola Preferred Device  
N–Channel Enhancement–Mode Silicon Gate  
TMOS POWER FET  
16 AMPERES  
250 VOLTS  
This advanced TMOS E–FET is designed to withstand high  
energy in the avalanche and commutation modes. The new energy  
efficient design also offers a drain–to–source diode with a fast  
recovery time. Designed for low voltage, high speed switching  
applications in power supplies, converters and PWM motor  
controls, these devices are particularly well suited for bridge circuits  
where diode speed and commutating safe operating areas are  
critical and offer additional safety margin against unexpected  
voltage transients.  
R
= 0.25 OHM  
DS(on)  
Avalanche Energy Specified  
Source–to–Drain Diode Recovery Time Comparable to a  
Discrete Fast Recovery Diode  
Diode is Characterized for Use in Bridge Circuits  
I
and V Specified at Elevated Temperature  
DSS  
DS(on)  
D
G
CASE 221A–06, Style 5  
TO–220AB  
S
MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
C
Rating  
Symbol  
Value  
Unit  
Drain–Source Voltage  
V
DSS  
250  
Vdc  
Drain–Gate Voltage (R  
GS  
= 1.0 M)  
V
DGR  
250  
Vdc  
Gate–Source Voltage — Continuous  
— Non–Repetitive (t 10 ms)  
V
± 20  
± 40  
Vdc  
Vpk  
GS  
V
GSM  
p
Drain Current — Continuous  
— Continuous @ 100°C  
— Single Pulse (t 10 µs)  
I
I
16  
10  
56  
Adc  
Apk  
D
D
I
p
DM  
Total Power Dissipation @ T = 25°C  
Derate above 25°C  
P
D
125  
1.0  
Watts  
W/°C  
C
Operating and Storage Temperature Range  
Single Pulse Drain–to–Source Avalanche Energy — Starting T = 25°C  
T , T  
stg  
55 to 150  
384  
°C  
J
E
AS  
mJ  
J
(V  
DD  
= 80 Vdc, V = 10 Vdc, I = 16 Apk, L = 3.0 mH, R = 25 )  
GS L G  
Thermal Resistance — Junction to Case  
— Junction to Ambient  
R
R
1.0  
62.5  
°C/W  
°C  
θJC  
θJA  
Maximum Lead Temperature for Soldering Purposes, 1/8from case for 10 seconds  
T
260  
L
Designer’s Data for “Worst Case” Conditions — The Designer’s Data Sheet permits the design of most circuits entirely from the information presented. SOA Limit  
curves — representing boundaries on device characteristics — are given to facilitate “worst case” design.  
E–FET and Designer’s are trademarks of Motorola, Inc. TMOS is a registered trademark of Motorola, Inc.  
Preferred devices are Motorola recommended choices for future use and best overall value.  
Motorola, Inc. 1995  

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