ADVANCE
16Mb : 1 MEG x 18, 512K x 32/36
PIPELINED, DCD SYNCBURST SRAM
16Mb SYNCBURST™
SRAM
MT58L1MY18D, MT58V1MV18D,
MT58L512Y32D, MT58V512V32D,
MT58L512Y36D, MT58V512V36D
3.3V VDD, 3.3V o r 2.5V I/O; 2.5V VDD, 2.5V
I/O, Pip e lin e d , Do u b le -Cycle De se le ct
FEATURES
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• Fast clock an d OE# access tim es
• Sin gle +3.3V ±0.165Vor 2.5V ±0.125V power supply
(VDD)
100-Pin TQFP
• Separate +3.3V or 2.5V isolated output buffer
supply (VDDQ)
• SNOOZE MODE for reduced-power stan dby
• Com m on data in puts an d data outputs
• In dividual BYTE WRITE con trol an d GLOBAL
WRITE
• Th ree ch ip en ables for sim ple depth expan sion an d
address pipelin in g
• Clock-con trolled an d registered addresses, data I/Os
an d con trol sign als
• In tern ally self-tim ed WRITE cycle
• Burst con trol (in terleaved or lin ear burst)
• Autom atic power-down
165-Pin FBGA
(Preliminary Package Data)
• 100-pin TQFP package
• 165-pin FBGA package
• Low capacitive bus loadin g
• x18, x32, an d x36 version s available
OPTIONS
TQFP MARKING*
• Tim in g (Access/Cycle/MHz)
3.5n s/6n s/166 MHz
4.0n s/7.5n s/133 MHz
5n s/10n s/100 MHz
-6
-7.5
-10
NOTE: 1. JEDEC-standard MS-026 BHA (LQFP).
• Con figuration s
3.3V VDD, 3.3V or 2.5V I/O
1 Meg x 18
MT58L1MY18D
MT58L512Y32D
MT58L512Y36D
GENERAL DESCRIPTION
Th e Micron ® Syn cBurst™ SRAM fam ily em ploys h igh -
speed, low-power CMOS design s th at are fabricated
usin g an advan ced CMOS process.
512K x 32
512K x 36
2.5V VDD, 2.5V I/O
1 Meg x 18
MT58V1MV18D
MT58V512V32D
MT58V512V36D
Micron ’s 16Mb Syn cBurst SRAMs in tegrate a 1 Meg x
18, 512K x 32, or 512K x 36 SRAM core with advan ced
syn ch ron ous periph eral circuitry an d a 2-bit burst
coun ter. All syn ch ron ous in puts pass th rough registers
con trolled by a positive-edge-triggered sin gle-clock in -
put (CLK). Th e syn ch ron ous in puts in clude all addresses,
all data in puts, active LOW ch ip en able (CE#), two
addition al ch ip en ables for easy depth expan sion (CE2,
CE2#), burst con trol in puts (ADSC#, ADSP#, ADV#),
byte write en ables (BWx#) an d global write (GW#). Note
th at CE2# is n ot available on th e T Version .
512K x 32
512K x 36
• Packages
100-pin TQFP (3-ch ip en able)
165-pin FBGA
T
F
• Operatin g Tem perature Ran ge
Com m ercial (0ºC to +70ºC)
Non e
*See page 34 for FBGA package m arkin g guide.
Asyn ch ron ous in puts in clude th e output en able
(OE#), clock (CLK) an d sn ooze en able (ZZ). Th ere is also
Part Number Example:
MT58L1MY18DT-7.5
16Mb: 1 Meg x 18, 512K x 32/36 Pipelined, DCD SyncBurst SRAM
MT58L1MY18D_2.p65 – Rev 7/00
Micron Technology, Inc., reserves the right to change products or specifications without notice.
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©2000, Micron Technology, Inc.