18Mb: 1 MEG x 18, 512K x 32/36
FLOW-THROUGH SYNCBURST SRAM
MT58L1MY18F, MT58V1MV18F,
MT58L512Y32F, MT58V512V32F,
MT58L512Y36F, MT58V512V36F
3.3V VDD, 3.3V or 2.5V I/O; 2.5V VDD, 2.5V I/O
18Mb SYNCBURST™
SRAM
Features
Figure 1: 100-Pin TQFP
JEDEC-Standard MS-026 BHA (LQFP)
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•
•
Fast clock and OE# access times
Single 3.3V ±± percent or 2.±V ±± percent power supply
Separate 3.3V±± percent or 2.±V ±± percent isolated
output buffer supply (VDDQ)
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•
•
•
SNOOZE MODE for reduced-power standby
Common data inputs and data outputs
Individual byte write control and global write
Three chip enables for simple depth expansion and
address pipelining
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Clock-controlled and registered addresses, data
I/Os, and control signals
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•
•
Internally self-timed write cycle
Burst control (interleaved or linear burst)
Low capacitive bus loading
Figure 2: 165-Ball FBGA
JEDEC-Standard MO-216 (Var. CAB-1)
TQFP
Marking
Options
•
Timing (Access/Cycle/MHz)
6.8ns/7.±ns/133 MHz
7.±ns/8.8ns/113 MHz
8.±ns/10ns/100 MHz
10ns/1±ns/66 MHz
-6.8
-7.±
-8.±
-10
•
Configurations
3.3V VDD, 3.3V or 2.±V I/O
1 Meg x 18
±12K x 32
±12K x 36
MT±8L1MY18F
MT±8L±12Y32F
MT±8L±12Y36F
Part Number Example:
MT58L512Y36FT-10
2.±V VDD, 2.±V I/O
1 Meg x 18
±12K x 32
±12K x 36
MT±8V1MV18F
MT±8V±12V32F
MT±8V±12V36F
General Description
The Micron® SyncBurst™ SRAM family employs
high-speed, low-power CMOS designs that are fabri-
cated using an advanced CMOS process.
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•
Packages
100-pin TQFP
16±-ball, 13mm x 1±mm FBGA
T
F1
Micron’s 18Mb SyncBurst SRAMs integrate a 1 Meg x
18, ±12K x 32, or ±12K x 36 SRAM core with advanced
synchronous peripheral circuitry and a 2-bit burst
counter. All synchronous inputs pass through registers
controlled by a positive-edge-triggered single-clock
input (CLK). The synchronous inputs include all
addresses, all data inputs, active LOW chip enable
(CE#), two additional chip enables for easy depth
expansion (CE2#, CE2), burst control inputs (ADSC#,
ADSP#, ADV#), byte write enables (BWx#), and global
write (GW#).
Operating Temperature Range
Commercial (0ºC
Industrial (-40ºC
?
T
?
+70ºC)
+8±ºC)
None
IT2
A
?
T
?
A
NOTE:
1. A Part Marking Guide for the FBGA devices can be found on
Micron’s Web site—http://www.micron.com/numberguide.
2. Contact factory for availability of Industrial Temperature
devices.
18Mb: 1 Meg x 18, 512K x 32/36, Flow-Through SyncBurst SRAM
MT58L1MY18F_16_D.fm – Rev. D, Pub. 2/03
©2003 Micron Technology, Inc.
1
PRODUCTS AND SPECIFICATIONS DISCUSSED HEREIN ARE SUBJECT TO CHANGE BY MICRON WITHOUT NOTICE.