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MT58L32L32PT-10 PDF预览

MT58L32L32PT-10

更新时间: 2024-11-07 21:19:47
品牌 Logo 应用领域
赛普拉斯 - CYPRESS 时钟静态存储器内存集成电路
页数 文件大小 规格书
18页 354K
描述
Cache SRAM, 32KX32, 5ns, CMOS, PQFP100, PLASTIC, TQFP-100

MT58L32L32PT-10 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
零件包装代码:QFP包装说明:LQFP,
针数:100Reach Compliance Code:unknown
ECCN代码:3A991.B.2.BHTS代码:8542.32.00.41
风险等级:5.47最长访问时间:5 ns
其他特性:PIPELINED ARCHITECTUREJESD-30 代码:R-PQFP-G100
JESD-609代码:e0长度:20 mm
内存密度:1048576 bit内存集成电路类型:CACHE SRAM
内存宽度:32湿度敏感等级:3
功能数量:1端子数量:100
字数:32768 words字数代码:32000
工作模式:SYNCHRONOUS最高工作温度:70 °C
最低工作温度:组织:32KX32
封装主体材料:PLASTIC/EPOXY封装代码:LQFP
封装形状:RECTANGULAR封装形式:FLATPACK, LOW PROFILE
并行/串行:PARALLEL峰值回流温度(摄氏度):225
认证状态:Not Qualified座面最大高度:1.6 mm
最大供电电压 (Vsup):3.6 V最小供电电压 (Vsup):3.135 V
标称供电电压 (Vsup):3.3 V表面贴装:YES
技术:CMOS温度等级:COMMERCIAL
端子面层:TIN LEAD (800)端子形式:GULL WING
端子节距:0.65 mm端子位置:QUAD
处于峰值回流温度下的最长时间:30宽度:14 mm
Base Number Matches:1

MT58L32L32PT-10 数据手册

 浏览型号MT58L32L32PT-10的Datasheet PDF文件第2页浏览型号MT58L32L32PT-10的Datasheet PDF文件第3页浏览型号MT58L32L32PT-10的Datasheet PDF文件第4页浏览型号MT58L32L32PT-10的Datasheet PDF文件第5页浏览型号MT58L32L32PT-10的Datasheet PDF文件第6页浏览型号MT58L32L32PT-10的Datasheet PDF文件第7页 
NOTRECOMENDEDFORNEWDESIGNS  
1Mb: 64K x 18, 32K x 32/36  
3.3V I/O, PIPELINED, SCD SYNCBURST SRAM  
1Mb SYNCBURST™  
SRAM  
MT58L64L18P, MT58L32L32P,  
MT58L32L36P  
3.3V VDD, 3.3V I/O, Pipelined, Single-  
Cycle Deselect  
FEATURES  
• Fast clock and OE# access times  
• Single +3.3V +0.3V/-0.165V power supply (VDD)  
• Separate +3.3V +0.3V/-0.165V isolated output  
buffer supply (VDDQ)  
100-Pin TQFP*  
• SNOOZE MODE for reduced-power standby  
• Single-cycle deselect (Pentium® BSRAM-  
compatible)  
• Common data inputs and data outputs  
• Individual BYTE WRITE control and GLOBAL  
WRITE  
• Three chip enables for simple depth expansion  
and address pipelining  
• Clock-controlled and registered addresses, data  
I/Os and control signals  
• Internally self-timed WRITE cycle  
• Burst control pin (interleaved or linear burst)  
• Automatic power-down for portable applications  
• 100-lead TQFP for high density, high speed SRAMs  
• Low capacitive bus loading  
*JEDEC-standard MS-026 BHA (LQFP).  
through registers controlled by a positive-edge-trig-  
gered single clock input (CLK). The synchronous in-  
puts include all addresses, all data inputs, active LOW  
chip enable (CE#), two additional chip enables for easy  
depth expansion (CE2, CE2#), burst control inputs  
(ADSC#, ADSP#, ADV#), byte write enables (BWx#) and  
global write (GW#).  
Asynchronous inputs include the output enable  
(OE#), clock (CLK) and snooze enable (ZZ). There is  
also a burst mode pin (MODE) that selects between  
interleaved and linear burst modes. The data-out (Q),  
enabled by OE#, is also asynchronous. WRITE cycles  
can be from one to two bytes wide (x18) or from one to  
four bytes wide (x32/x36), as controlled by the write  
control inputs.  
• x18, x32, and x36 options available  
OPTIONS  
MARKING  
• Timing (Access/Cycle/MHz)  
3.5ns/6.0ns/166 MHz  
4.2ns/7.5ns/133 MHz  
5ns/10ns/100 MHz  
• Configurations  
64K x 18  
-6  
-7.5  
-10  
MT58L64L18P  
MT58L32L32P  
MT58L32L36P  
32K x 32  
32K x 36  
• Package  
100-pin TQFP  
T
• Operating Temperature Range  
Commercial (0ºC to +70ºC)  
None  
Burst operation can be initiated with either address  
status processor (ADSP#) or address status controller  
(ADSC#) input pins. Subsequent burst addresses can  
be internally generated as controlled by the burst ad-  
vance pin (ADV#).  
Part Number Example:  
MT58L64L18PT-10  
GENERALDESCRIPTION  
Address and write control are registered on-chip to  
simplify WRITE cycles. This allows self-timed WRITE  
cycles. Individual byte enables allow individual bytes  
to be written. During WRITE cycles on the x18 device,  
BWa# controls DQa pins and DQPa; BWb# controls DQb  
pins and DQPb. During WRITE cycles on the x32 and  
x36 devices, BWa# controls DQa pins and DQPa; BWb#  
controls DQb pins and DQPb; BWc# controls DQc pins  
The Micron® SyncBurstSRAM family employs  
high-speed, low-power CMOS designs that are fabri-  
cated using an advanced CMOS process.  
The MT58L64L18P and MT58L32L32/36P 1Mb  
SRAMs integrate a 64K x 18, 32K x 32, or 32K x 36 SRAM  
core with advanced synchronous peripheral circuitry  
and a 2-bit burst counter. All synchronous inputs pass  
1Mb:64Kx18, 32Kx32/363.3VI/O, Pipelined, SCDSyncBurstSRAM  
MT58L64L18P_B.p65 – Rev. B, Pub. 11/02  
©2002,MicronTechnology,Inc.  
1
PRODUCTS AND SPECIFICATIONS DISCUSSED HEREIN ARE SUBJECT TO CHANGE BY MICRON WITHOUT NOTICE.  

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