5秒后页面跳转
MT58L32L32PT-7.5T PDF预览

MT58L32L32PT-7.5T

更新时间: 2024-11-07 14:53:59
品牌 Logo 应用领域
赛普拉斯 - CYPRESS 静态存储器内存集成电路
页数 文件大小 规格书
17页 239K
描述
Cache SRAM, 32KX32, 4.2ns, CMOS, PQFP100, PLASTIC, MS-026, TQFP-100

MT58L32L32PT-7.5T 技术参数

生命周期:Obsolete零件包装代码:QFP
包装说明:LQFP,针数:100
Reach Compliance Code:unknownECCN代码:3A991.B.2.B
HTS代码:8542.32.00.41风险等级:5.6
Is Samacsys:N最长访问时间:4.2 ns
其他特性:PIPELINED ARCHITECTUREJESD-30 代码:R-PQFP-G100
长度:20 mm内存密度:1048576 bit
内存集成电路类型:CACHE SRAM内存宽度:32
功能数量:1端子数量:100
字数:32768 words字数代码:32000
工作模式:SYNCHRONOUS最高工作温度:70 °C
最低工作温度:组织:32KX32
封装主体材料:PLASTIC/EPOXY封装代码:LQFP
封装形状:RECTANGULAR封装形式:FLATPACK, LOW PROFILE
并行/串行:PARALLEL认证状态:Not Qualified
座面最大高度:1.6 mm最大供电电压 (Vsup):3.6 V
最小供电电压 (Vsup):3.135 V标称供电电压 (Vsup):3.3 V
表面贴装:YES技术:CMOS
温度等级:COMMERCIAL端子形式:GULL WING
端子节距:0.65 mm端子位置:QUAD
宽度:14 mmBase Number Matches:1

MT58L32L32PT-7.5T 数据手册

 浏览型号MT58L32L32PT-7.5T的Datasheet PDF文件第2页浏览型号MT58L32L32PT-7.5T的Datasheet PDF文件第3页浏览型号MT58L32L32PT-7.5T的Datasheet PDF文件第4页浏览型号MT58L32L32PT-7.5T的Datasheet PDF文件第5页浏览型号MT58L32L32PT-7.5T的Datasheet PDF文件第6页浏览型号MT58L32L32PT-7.5T的Datasheet PDF文件第7页 
1Mb: 64K x 18, 32K x 32/36  
3.3V I/O, PIPELINED, SCD SYNCBURST SRAM  
MT58L64L18P, MT58L32L32P,  
MT58L32L36P  
3.3V VDD, 3.3V I/O, Pipelined, Single-Cycle  
Deselect  
1Mb SYNCBURST™  
SRAM  
FEATURES  
• Fast clock and OE# access times  
• Single +3.3V +0.3V/ -0.165V power supply (VDD)  
• Separate +3.3V +0.3V/ -0.165V isolated output buffer  
supply (VDDQ)  
100-Pin TQFP**  
(D-1)  
• SNOOZE MODE for reduced-power standby  
®
• Single-cycle deselect (Pentium BSRAM-compatible)  
• Common data inputs and data outputs  
• Individual BYTE WRITE control and GLOBAL WRITE  
• Three chip enables for simple depth expansion and  
address pipelining  
• Clock-controlled and registered addresses, data I/ Os  
and control signals  
• Internally self-timed WRITE cycle  
• Burst control pin (interleaved or linear burst)  
• Automatic power-down for portable applications  
• 100-lead TQFP for high density, high speed  
• Low capacitive bus loading  
**JEDEC-standard MS-026 BHA (LQFP).  
• x18, x32 and x36 options available  
controlled by a positive-edge-triggered single clock input  
(CLK). The synchronous inputs include all addresses, all  
data inputs, active LOW chip enable (CE#), two additional  
chip enables for easy depth expansion (CE2, CE2#), burst  
control inputs (ADSC#, ADSP#, ADV#), byte write enables  
(BWx#) and global write (GW#).  
OPTIONS  
MARKING  
• Timing (Access/ Cycle/ MHz)  
3.5ns/ 6.0ns/ 166 MHz  
4.2ns/ 7.5ns/ 133 MHz  
5ns/ 10ns/ 100 MHz  
-6  
-7.5  
-10  
Asynchronous inputs include the output enable (OE#),  
clock (CLK) and snooze enable (ZZ). There is also a burst  
mode pin (MODE) that selects between interleaved and  
linear burst modes. The data-out (Q), enabled by OE#, is  
also asynchronous. WRITE cycles can be from one to two  
bytes wide (x18) or from one to four bytes wide (x32/ x36),  
as controlled by the write control inputs.  
• Configurations  
64K x 18  
MT58L64L18P  
MT58L32L32P  
MT58L32L36P  
32K x 32  
32K x 36  
• Package  
100-pin TQFP  
T
Burst operation can be initiated with either address status  
processor (ADSP#) or address status controller (ADSC#)  
input pins. Subsequent burst addresses can be internally  
generated as controlled by the burst advance pin (ADV#).  
Address and write control are registered on-chip to  
simplify WRITEcycles.Thisallowsself-timed WRITEcycles.  
Individualbyte enables allow individualbytes to be written.  
During WRITE cycles on the x18 device, BWa# controls  
DQa pins and DQPa; BWb# controls DQb pins and DQPb.  
During WRITE cycles on the x32 and x36 devices, BWa#  
controls DQa pins and DQPa; BWb# controls DQb pins and  
DQPb; BWc# controls DQc pins and DQPc; BWd# controls  
DQd pins and DQPd. GW# LOW causes all bytes to be  
written. Parity pins are only available on the x18 and x36  
versions.  
• Temperature  
Commercial (0°C to +70°C)  
Industrial (-40°C to +85°C)  
None  
T*  
• Part Number Example: MT58L64L18PT-10 T  
*Under consideration.  
GENERAL DESCRIPTION  
®
The Micron SyncBurst SRAM family employs high-  
speed, low-power CMOS designs that are fabricated using  
an advanced CMOS process.  
The MT58L64L18P and MT58L32L32/ 36P 1Mb SRAMs  
integrate a 64K x 18, 32K x 32, or 32K x 36 SRAM core with  
advanced synchronous peripheral circuitry and a 2-bit  
burst counter.Allsynchronousinputspassthrough registers  
1Mb: 64K x 18, 32K x 32/36 3.3V I/O, Pipelined, SCD SyncBurst SRAM  
MT58L64L18P.p65 – Rev. 6/99  
Micron Technology, Inc., reserves the right to change products or specifications without notice.  
1999, Micron Technology, Inc.  
All registered and unregistered trademarks are the sole property of their respective companies.  
1

与MT58L32L32PT-7.5T相关器件

型号 品牌 获取价格 描述 数据表
MT58L32L36DT-10 CYPRESS

获取价格

Cache SRAM, 32KX36, 5ns, CMOS, PQFP100, PLASTIC, TQFP-100
MT58L32L36DT-7.5 CYPRESS

获取价格

Cache SRAM, 32KX36, 4.2ns, CMOS, PQFP100, PLASTIC, TQFP-100
MT58L32L36FT-10 CYPRESS

获取价格

Cache SRAM, 32KX36, 10ns, CMOS, PQFP100, PLASTIC, MS-026BHA, TQFP-100
MT58L32L36FT-10IT CYPRESS

获取价格

Cache SRAM, 32KX36, 10ns, CMOS, PQFP100, PLASTIC, MS-026BHA, TQFP-100
MT58L32L36FT-8.5 CYPRESS

获取价格

Cache SRAM, 32KX36, 8.5ns, CMOS, PQFP100, PLASTIC, MS-026BHA, TQFP-100
MT58L32L36FT-8.5IT CYPRESS

获取价格

Cache SRAM, 32KX36, 8.5ns, CMOS, PQFP100, PLASTIC, MS-026BHA, TQFP-100
MT58L32L36PT-10T CYPRESS

获取价格

Cache SRAM, 32KX36, 5ns, CMOS, PQFP100, PLASTIC, MS-026, TQFP-100
MT58L32L36PT-6 CYPRESS

获取价格

Cache SRAM, 32KX36, 3.5ns, CMOS, PQFP100, PLASTIC, TQFP-100
MT58L512L18D MICRON

获取价格

8Mb: 512K x 18, 256K x 32/36 3.3V I/O, PIPELINED, DCD SYNCBURST SRAM
MT58L512L18DB-10IT CYPRESS

获取价格

Standard SRAM, 512KX18, 5ns, CMOS, PBGA119, 14 X 22 MM, PLASTIC, MS-028BHA, BGA-119